Philip Avery

Personal Profile

Philip Avery

Title:

Senior Research Engineer

Department(s):

Mechanical Engineering

Location:

Durand, 028A

Mail Code:

Phone:

(650) 725-9328

Fax:

E-mail:

pavery

@stanford.edu

URL:

Research Statement:

I am interested in parallel computing, particularly domain decomposition methods such as Finite Element Tearing and Interconnecting (FETI), and currently involved with several projects in this field: inequality constraints (contact) including mortar elements, coupled elasto-acoustic frequency response, stochastic finite elements, and multilevel methods.

Additional Information

Education:

Ph.D. 1998, Queensland University of Technology, Brisbane, Australia
B.E. 1994, Queensland University of Technology, Brisbane, Australia

Publications:

Avery, P., Farhat, C. and Reese, G. (2007) "Fast frequency sweep computations using a multi-point Pade-based reconstruction method and an efficient iterative solver", International Journal for Numerical Methods in Engineering, vol. 69, no. 13, pp. 2848-2875.

Bavestrello, H., Avery, P. and Farhat, C. (2007) "Incorporation of linear multipoint constraints in domain-decomposition-based iterative solvers - Part II: Blending FETI-DP and mortar methods and assembling floating substructures",Computer Methods in Applied Mechanics and Engineering, vol. 86, issue 8, pp. 1347-1368.

Farhat, C., Li, J. and Avery, P. (2005) "A FETI-DP method for the parallel iterative solution of indefinite and complex-valued solid and shell vibration problems", International Journal for Numerical Methods in Engineering, vol. 63, no. 3, pp. 398-427.

Farhat, C., Avery, P., Tezaur, R. and Li, J. (2005) "FETI-DPH: A dual-primal domain decomposition method for acoustic scattering", Journal of Computational Acoustics, vol. 13, no. 3, pp. 499-524.

Avery, P., Rebel, G., Lesoinne, M. and Farhat, C. (2004) "A numerically scalable dual-primal substructuring method for the solution of contact problems - part I: the frictionless case", Computer Methods in Applied Mechanics and Engineering, vol. 193, pp. 2403-2426.