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photo of Joe Haemer Joe M. Haemer, MS
Research Assistant

Education

Georgia Institute of Technology - 1998, BSME
Georgia Institute of Technology - 2000, MSME
Stanford University - 2003 to Present, ME PhD Candidate

Projects

Mechanical Etiology of Osteoarthritis following Meniscectomy

Affiliations

California Professional Engineer, M32567

Research Interests

Osteoarthritis
Cartilage and meniscus mechanobiology
Finite element analysis of biological tissues

Recent Publication

J. M. Haemer, S. K. Sitaraman, D. K. Fork, F. C. Chong, S. Mok, D. L. Smith, and F. Swiatowiec, "Flexible micro spring interconnects for high performance probing", Proc. of the 50th Electronics Components and Technology Conference (ECTC), May 2000, pp.1157-1163.

In Press

Haemer JM, Wang MJ, Carter DR, Giori NJ: Benefit of Single Leaf Resection for Horizontal Meniscus Tear in an Ovine Model. Clin Orthop in press. Accepted for publication on Oct 25, 2006.

In Review

Haemer, JM, MJ Wang, DR Carter,, and NJ Giori: “No Benefit of Sparing Single Leaf in Extensive Horizontal Meniscus Tears,” Clinical Orthopedics and Related Research, submitted.

Abstracts

Haemer JM, Giori NJ: A finite element method for articular cartilage mechanics from MRI of loaded joints. Proc 52nd Ann Mtg Orthopedic Research Society, Chicago, IL, 52:81, 2006.

Haemer JM, Wang MJ, Giori NJ: Biomechanical Assessment of Single- versus Double-Leaf Resection Following Horizontal Meniscus Tear. Proc 73rd Ann Mtg American Academy of Orthopedic Surgeons, Chicago, IL, 73:157, 2006.

Recent Presentations

J. Haemer, M. Wang, N.J. Giori, "Single leaf removal in horizontal meniscus tear is biomechanically comparable to total meniscectomy". Northwest Biomechanics Symposium, Seattle, May 2005.

Awards

  • Georgia Tech President's Scholar
  • IMAPS Educational Foundation Graduate Fellowship

Patent Applications

  • 20030218244 Miniaturized contact spring
  • 20030214045 Miniaturized contact spring
  • 20030099097 Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs

Last updated 10/10/2007