Thermal Engineering of Electronic Microstructures
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6. Near-Field Photothermal Diagnostics and Processing
Daniel A. Fletcher

Figure 1:
 


Figure 2: The spatial reolution of infrared imaging is improved through the development of a scanning solid immersion lens, made from silicon.

Figure 3:
 
 
 

Collaboration
Group of Professor G. Kino, Electrical Engineering Department, Stanford University
Group of Professor T. Smith, Physics Department, Stanford University

Publication

Goodson, K.E., and Asheghi, M., 1997, "Near-Field Optical Thermometry," Microscale Thermophysical Engineering, Vol. 1, pp. 225-235.
 

Sponsorship

NSF Graduate Fellowship
NSF Grant CTS-9622178
NSF Grant CTS-9624696 (CAREER Award)
ONR Grant 96-1-0688 (Young Investigator Award, Electronics Division)
 
 



Research Projects
New! Micromachined Two-Phase Heat Exchangers
1. Thermal Engineering of IC Devicesand Metallization
2. Thermal Conduction in Diamond Films
3. Thermal Conduction in Organic Films and Devices
4. Thermal Conduction in Silicon Films and Devices
5. Thermal Engineering of IC Packaging
6. Near-Field Photothermal Diagnostics
7. Novel Thermal MEMS
8. Microdevices in the Heat Transfer Teaching Laboratory


Last Update: February 26, 1999.
Comments: Bill King