1. Pop, E., Sinha, S., and Goodson, K.E., 2005, "Heat Generation and Transport in Nanometer Scale Transistors," Proceedings of the IEEE, in press.

2. McConnell, A.D., and Goodson, K.E., 2005, "Thermal Conduction in Silicon Micro and Nanostructures," Annual Review of Heat Transfer, in press.

3. Sinha S., and Goodson, K.E., "Review: Multiscale Thermal Modeling in Nanoelectronics," International Journal of Multiscale Computational Engineering, Vol. 3, pp. 107-133.

4. L. Zhang, Goodson, K.E., and Kenny, T.W., 2003, Book: Silicon Microchannel Heat Sinks-Theories and Phenomena, Springer-Verlag Microtechnology and MEMS Series, ISBN 3-540-40181-4.

5. King, W.P., and Goodson, K.E., 2002, "Thermomechanical Formation and Thermal Imaging of Polymer Nanostructures" in Heat Transfer and Fluid Flow in Microscale and Nanoscale Devices, M. Faghri and B. Sunden, Eds., Southampton: WIT Press, pp. 131-171.

6. Goodson, K.E., 2000, "Thermal Conduction in Electronic Microstructures," in the Thermal Engineering Handbook, F. Kreith, ed., CRC Press, Boca Raton, Florida, pp. 4.458 - 4.504.

7. Goodson, K.E., and Ju, Y.S., 1999, "Heat Conduction in Novel Electronic Films," in the Annual Review of Materials Science, E.N. Kaufmann et al., eds., Annual Reviews, Palo Alto, CA, Vol. 29, pp. 261-293.

8. Ju, Y.S., and Goodson, 1999, Book: Microscale Heat Conduction in Integrated Circuits and their Constituent Films, Kluwer Academic Publishers, Boston.

9. Goodson, K.E., Ju, Y.S., and Asheghi, M., 1998, "Thermal Phenomena in Semiconductor Devices and Interconnects," in Microscale Energy Transport, C.L. Tien et al., eds., Taylor & Francis, New York, NY, pp. 229-293.

10. Goodson, K.E., 1995, "Impact of CVD Diamond Layers on the Thermal Engineering of Electronic Systems," in the Annual Review of Heat Transfer, C.L. Tien, ed., Begell House, New York, NY, Vol. 6, pp. 323-353.

B. Archival Journal Articles - Refereed

1. Sinha, S., Pop, E., Dutton R.W., and Goodson, K.E., 2005, "Non-Equilibrium Phonon Distributions in Sub-100 nm Silicon Transistors," submitted to the ASME Journal of Heat Transfer.

2. McConnell, A., and Goodson, K.E., 2005, "Measurement of the Thermal Properties of High-Resistance Nanostructures using Transient Electrical Thermometry," submitted to the ASME Journal of Heat Transfer.

3. Koo, J.M., Im, S., Jiang, L., and Goodson, K.E., 2005, "Integrated Microchannel Cooling for Three-Dimensional Circuit Architectures," ASME Journal of Heat Transfer, Vol. 127, pp. 49-58.

4. Wang, E.N., Devasenathipathy, S., Lin, H., Hidrovo, C., Santiago, J.G., Goodson, K.E., and Kenny, T.W., 2005, "A Hybrid Method for Bubble Reconstruction in Two-Phase Microchannels," submitted to Experiments in Fluids.

5. Mann, D., Pop, E., Cao, Wang, Q., Goodson, K.E., and Dai, H., 2005, "Temperature and Gas-Environment Dependent Electron and Phonon Transport in Suspended Carbon Nanotubes Up to Electrical Breakdown," submitted to Physical Review Letters.

6. Steinbrenner, J. E., Hidrovo, C. H., Wang, F.-M., Lee, E. S., Vigneron, S., Kramer, T. A., Cheng, C.-H., Eaton, J. K., and Goodson, K. E., 2005, "Measurement and Modeling of Liquid Film Thickness Evolution in Stratified Two-Phase Microchannel Flows" submitted to Applied Thermal Engineering.

7. Im, S., Srivastava, N., Banerjee, K., and Goodson, K.E., 2005, "Scaling Analysis of Multilevel Interconnect Temperatures for High-Performance ICs," IEEE Transactions on Electron Devices, in press.

8. Sinha, S., and Goodson, K.E., 2005, "Thermal Conduction in Sub 100-nm Transistors," Microelectronics Journal, in press.

9. Hidrovo, C. H., Kramer, T. A., Wang, E. N., Vigneron, S., Steinbrenner, J. E., Koo, J.-M., Wang, F.-M., Fogg, D. W., Flynn, R. D., Lee, E. S., Cheng, C.-H., Kenny, T. W., Eaton, J. K. and Goodson, K. E., 2005, "Two-Phase Microfluidics for Semiconductor Circuits and Fuel Cells," Heat Transfer Engineering, in press.

10. Pop, E., Mann, D., Cao, J., Wang, Q., Goodson, K.E., and Dai, H., 2005, "Negative Differential Conductance and Hot Phonons in Suspended Nanotube Molecular Wires," Physical Review Letters, in press.

11. Pop, E., and Goodson, K.E., 2005, "Thermal Phenomena in Nanoscale Transistors," IEEE Transactions on Electronic Packaging, in press.

12. Shelling, P., Li, S., and Goodson, K.E., 2005, "Managing Heat for Electronics," Materials Today, June, pp. 30-35.

13. Pop, E., Dutton, R.W., and Goodson, K.E., 2004, "Monte Carlo simulation of Joule Heating in Bulk and Strained Silicon," Applied Physics Letters, Vol. 86, pp. 082101-082103.

14. Pop, E., Dutton, B., and Goodson, K.E., 2004, "Analytic Band Monte Carlo Model for Electron Transport Modeling in Si Including Acoustic and Optical Phonon Dispersion," Journal of Applied Physics, Vol. 96, no. 9, pp. 4998-5005.

15. Wang, E.N., Zhang, L., Jiang, L., Koo, J.M., Maveety, J., Sanchez, E., Goodson, K.E., and Kenny, T.W., 2004, "Micromachined Jets for Liquid Impingement Cooling of VLSI Chips," Journal of MicroElectroMechanical Systems, Vol. 13, pp. 833-842.

16. Wang, E.N., Devasenathipathy, S., Santiago, J.G., Goodson, K.E., and Kenny. T.W., 2004, "Nucleation and Growth of Vapor Bubbles in a Heated Silicon Microchannel," ASME Journal of Heat Transfer, Vol. 128, p. 497.

17. Sinha, S., Shelling, P.K., Phillpot, S.R., Goodson, K.E., "Scattering of g-Process Longitudinal Phonons at Hotspots in Silicon," Journal of Applied Physics, Vol. 97, no.2, pp. 023702-1-023702-9.

18. Jain, A., Ness, K.D., Mehenti, N.Z., Fishman, H.A., and Goodson, K.E., 2005, "A microheater device for study of temperature gradient effects on neurite outgrowth in retinal ganglion cells" Investigative Opthalmology and Visual Science, Vol. 45, p. U401.

19. Wheeler, E.K., Benett, W., Stratton, P., Richards, J., Chen, A., Christian, A., Ness, K.D., Ortega, J., Li, L.G., Weisgraber, T.H., Goodson, K., Milanovich, F., 2004, "Convectively Driven Polymerase Chain Reaction Thermal Cycler," Analytical Chemistry, vol.76, no.14, , pp. 4011-4016.

20. Chu, D., Wong, W.K., Goodson, K.E., and Pease, R.F.W., 2004, "Transient Temperature Measurements of Resist Heating using Nano Thermocouples," Journal of Vacuum Science and Technology B, Vol. 21, pp. 2985-2989.

21. King, W.P., Kenny, T.W., and Goodson, K.E., 2004, "Comparison of Thermal and Piezoresistive Sensing Approaches for Atomic Force Microscopy Topography Measurements," Applied Physics Letters, Vo,. 85, pp. 2086-2088.

22. Fletcher, D.A., Kino, D.S., and Goodson, K.E., 2003, "Thermal Microscopy with a Microfabricated Solid Immersion Lens," Microscale Thermophysical Engineering, Vol. 7, pp. 267-273.

23. Zhang, L., Wang, E.N., Goodson, K.E., and Kenny, T.W., 2003, "Phase Change Phenomena in Silicon Microchannels," International Journal of Heat and Mass Transfer, Vol. 48, no.8, pp.1572-1582

24. Cahill, D.G., Ford, W.K., Goodson, K.E., Mahan, G.D., Majumdar, A., Maris, H.J., Merlin, R., and Phillpot, S.R., 2003, "Nanoscale Thermal Transport," Journal of Applied Physics, Vol. 93, 793-818.

25. Goodson, K.E., Santiago, J.G., Kenny, T., Jiang, L., Zeng, S., Koo, J.M., Zhang, L., Yao, S., and Wang, E., 2002 "Electroosmotic Microchannel Cooling System for Microprocessors," Electronics Cooling, Vol. 8, No. 4, pp. 46-47.

26. Chu, D.C., Touzelbaev, M., Goodson, K.E., Babin, S., and Pease, R.F., 2001, "Thermal Conductivity Measurements of Thin-Film Resist," Journal of Vacuum Science & Technology B, Vol. 19, pp. 2874-2877.

27. King, W.P., Kenny, T.W., Goodson, K.E., Cross, G.L.W., Despont, M., Durig, U.T., Rothuizen, H., Binnig, G.K., and Vettiger, P., 2002, "Design of Atomic Force Microscope Cantilevers for Combined Thermomechanical Writing and Thermal Reading in Array Operation," Journal of MicroElectroMechanical Systems, pp. 765-774.

28. Goodson, K., Santiago, J., Kenny, T., Jiang, L., Zeng, S., Koo, J - M., Zhang, L., Yao, S., and Wang, E., "Electroosmotic Microchannel Cooling System for Microprocessors," Technical Brief, Electronics Cooling, Vol. 8, No. 4, 2002, pp. 46-47.

29. Jiang, L., Mikkelsen, J., Koo, J.-M., Huber, D., Yao, S., Zhang, L., Zhou, P., Maveety, J., Prasher, R., Santiago, J.G., Kenny, T.W. Goodson, K.E., 2001, "Closed-Loop Electroosmotic Cooling System for VLSI Circuits," IEEE Proceedings on Components, Packaging, and Manufacturing Technology, Vol. 25, No. 3, pp. 347-355, 2002.

30. Cahill, D., Goodson, K.E., and Majumdar, A., "Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures," invited contribution for the ASME Journal of Heat Transfer, Vol. 124, No. 2, 2002, pp. 223-240.

31. King, W.P., and Goodson, K.E., 2002, "Thermal Writing and Nanoimaging with a Heated Atomic Force Microscope Cantilever," Journal of Heat Transfer, Vol. 124, p. 597.

32. Asheghi, M., Kurabayashi, K., Kasnavi, K., and Goodson, K.E., 2002, "Thermal conduction in doped single-crystal silicon films," Journal of Applied Physics, Vol. 91, pp 5079-5088.

33. McConnell, A.D., Srinivasan, U, Asheghi, M., and Goodson, K.E., 2001, "Thermal Conductivity of Doped Polysilicon," IEEE/ASME Journal of MicroElectroMechanical Systems, Vol. 10, pp. 360-369.

34. Zhou, P., and Goodson, K.E., 2001, "Subpixel Displacement and Deformation Gradient Measurement using Digital Image/Speckle Correlation (DISC)," Optical Engineering, Vol. 40, pp. 1613-1620.

35. Zhang L., Koo J.M., Jiang L., Goodson K.E., Santiago J.G., Kenny T.W., "Measurements and Modeling of Two-Phase Flow in Microchannels with Nearly-Constant Heat Flux Boundary Conditions," IEEE/ASME Journal of MicroElectroMechanical Engineering, Vol. 11, pp. 12-19.

36. Fletcher, D.A., Crozier, K.B., Quate, C.F., Kino, G.S., Goodson, K.E., Simanovskii, D., Palanker, D.V., 2001, "Refraction Contrast Imaging with a Scanning Microlens," Applied Physics Letters, Vol. 78, pp. 3589-3591.

37. Fletcher, D.A., Crozier, K.B., Guarini, K.W., Minne, S.C., Kino, G.S., Quate, C.F., and Goodson, K.E., 2001, "Microfabricated Silicon Solid Immersion Lens," submitted to IEEE/ASME Journal of MicroElectroMechanical Engineering, Vol. 10, pp. 450-459.

38. Fletcher, D.A., Goodson, K.E., and Kino, G.S., 2001, "Focussing in Microlenses Close to a Wavelength in Diameter," Optics Letters, Vol. 26, pp. 399-401.

39. Fletcher, D.A., Crozier, K.B., Quate, C.F., Kino, K.S., Goodson, K.E., Simanovskii, D., and Palanker, D.V., 2000, "Near-field infrared imaging with a microfabricated solid immersion lens," Applied Physics Letters, Vol. 77, pp. 2109-2111.

40. Sverdrup, P.G., Sinha, S., Uma, S., Asheghi, M., and Goodson, K.E., 2001, "Measurement of Ballistic Phonon Conduction Near Hotspots in Silicon," Applied Physics Letters, Vol. 78, pp. 3331-3333.

41. King, W.P., Kenny, T.W., Goodson, K.E., Cross, G., Despont, M., Durig, U., Rothuizen, H., Binnig, G.K., and Vettiger, P., 2001, "Atomic Force Microscope Cantilevers for Combined Thermomechanical Data Writing and Reading," Applied Physics Letters, Vol. 78, pp. 1300-1302.

42. Durig, U., Cross, G., Despont, M., Drechsler, U., Haberle, W., Lutwyche, M.I., Rothuizen, H., Stutz, R., Widmer, R., Vettiger, P., 2000, King, W.P., and Goodson, K.E., "'Millipede' : An AFM Data Storage System at the Frontier of Nanotribology," Tribology Letters, Vol. 9, pp. 25-32.

43. Touzelbaev, M.N., Zhou, P., Venkatasubramanian, R., Goodson, K.E., 2001, "Thermal Characterization of Bi2Te3/Sb2Te3 Superlattices," Journal of Applied Physics, Vol. 90, pp. 763-767.

44. Durig, U., Cross, G., Despont, M., Drechsler, U., Haeberle, W., Lutwyche, M.I., Rothuizen, H., Stutz, R., Widmer, R., Vettiger, P., Binnig, G.K., King, W.P., and Goodson, K.E., 2000, "Millipede - An AFM Data Storage System at the Frontier of Nanotribology," Tribology Letters, Vol. 9, pp. 25-32.

45. Sverdrup, P. G., Ju, Y. S., and Goodson, K. E., 2000, "Sub-Continuum Simulations of Heat Conduction in Silicon-on-Iinsulator Transistors," ASME J. Heat Transfer, 123, 30.

46. Uma, S., McConnell, A.D., Asheghi, M., Kurabayashi, K., and Goodson, K.E., 2001, "Temperature Dependent Thermal Conductivity of Undoped Polycrystalline Silicon Layers," International Journal of Thermophysics, Vol. 22, pp. 605-616.

47. Touzelbaev, M.N., and Goodson, K.E, 2001, "Impact of Experimental Timescale and Geometry on Thin-Film Thermal Property Measurements," International Journal of Thermophysics, Vol. 22, pp. 243-263.

48. Zhou, P., and Goodson, K.E., 1999, "Diagnostics of FLIP-CHIP/BGA Structures using Phase-Shifting Speckle-Pattern Interferometry," Journal of Electronic Packaging, in press.

49. Fletcher, D.A., Crozier, K.B., Kino, G.S., Quate, C.F., Goodson, K.E., Simanovskii, D., and Palanker, D.V., 2000, "Near-Field Infrared Imaging with a Microfabricated Solid Immersion Lens," Applied Physics Letters, Vol. 77, pp. 2109-2111.

50. Kurabayashi, K., and Goodson, K.E., 1999, "Impact of Molecular Orientation on Thermal Conduction in Spin-Coated Polyimide Films," Journal of Applied Physics, Vol. 86, pp. 1925-1931.

51. Ju, Y.S., and Goodson, K.E., 1999, "Phonon Scattering in Silicon Films of Thickness Below 100 nm," Applied Physics Letters, Vol. 74, pp. 3005-3007.

52. Kurabayashi, K., Asheghi, M., Touzelbaev, M.N., and Goodson, K.E., 1999, "Measurement of the Thermal Conductivity Anisotropy in Polyimide Films," IEEE/ASME Journal of MicroElectroMechanical Systems, Vol. 8, pp. 180-191.

53. Chui, B.W., Asheghi, M., Ju, Y.S., Goodson, K.E., Kenny, T.W., and Mamin, H.J., 1999, "Intrinsic-Carrier Thermal Runaway in Silicon Microcantilevers," Microscale Thermophysical Engineering, Vol. 3, pp. 217-224.

54. Ju, Y.S., and Goodson, K.E., 1999, "Process-Dependent Thermal Transport Properties of Silicon Dioxide Films Deposited using Low-Pressure Chemical Vapor Deposited," Journal of Applied Physics, Vol. 85, pp. 7130-7134.

55. Ju, Y.S., Kurabayashi, K., and Goodson K.E., 1999, "Thermal Characterization of Anisotropic Thin Dielectric Films using Harmonic Joule Heating," Thin Solid Films, Vol. 339, pp. 160-164.

56. Asheghi, M., Touzelbaev, M.N., Goodson, K.E., Leung, Y.K., and Wong, S.S., 1998, "Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates," ASME Journal of Heat Transfer, Vol. 120, pp. 31-36.

57. Touzelbaev, M.N., and Goodson, K.E., 1998, "Applications of Micron-Scale Passive Diamond Layers for the IC and MEMS Industries," Diamond and Related Materials, Vol. 7, pp. 1 - 14.

58. Ju, Y.S., and Goodson, K.E., 1998, "Short-Time-Scale Thermal Mapping of Microdevices using a Scanning Thermoreflectance Technique," ASME Journal of Heat Transfer, Vol. 120, pp. 306-313.

59. Kurabayashi, K., and Goodson, K.E., 1998, "Precision Measurement and Mapping of Die-Attach Thermal Resistance," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. A21, pp. 506-514.

60. Cahill, D., Chen, G., Dresselhaus, M.S., Goodson, K.E., Ho, C.M., Longtin, J., Majumdar, A., Phinney, L., Pohl, R., Tien, C.L., Wong, C., 1998, "Report of Workshop: 2nd Microthermal Workshop and Tutorial at the Albuquerque Convention Center," Microscale Thermophysical Engineering, Vol. 2, pp. 215-244.

61. Ju, Y.S., Kurabayashi, K., and Goodson, K.E., 1998, "Thermal Characterization of IC Interconnect Passivation using Joule Heating and Optical Thermometry," Microscale Thermophysical Engineering, Vol. 2, pp. 101-110.

62. Chaudhari, A., Woudenberg, T., Albin, M., and Goodson, K.E., 1998, "Transient Liquid-Crystal Thermometry of Microfabricated PCR Vessel Arrays," IEEE/ASME Journal of MicroElectroMechanical Systems, Vol. 7, pp. 345-355.

63. Chui, B.W., Stowe, T.D., Ju, Y.S., Goodson, K.E., Kenny, T.W., Mamin, H.J., Terris, B.D., Ried, R.P., and Rugar, D., 1998, "Low-Stiffness Silicon Cantilevers with Integrated Heaters and Piezoresistive Sensors for High-Density AFM Thermomechanical Data Storage," IEEE/ASME Journal of MicroElectroMechnical Systems, Vol. 7, pp. 69-78.

64. Touzelbaev, M.N., and Goodson K.E., 1997, "Impact of Nucleation Density on Thermal Resistance Near Diamond-Substrate Boundaries," AIAA Journal of Thermophysics and Heat Transfer, Vol. 11, pp. 506-512.

65. Ju, Y.S., and Goodson, K.E., 1997, "Thermal Mapping of Interconnects Subjected to Brief Electrical Stresses," IEEE Electron Device Letters, Vol. 18, pp. 512-514.

66. Asheghi, M., Leung, Y.K., Wong, S.S., and Goodson, K.E., 1997, "Phonon-Boundary Scattering in Thin Silicon Layers," Applied Physics Letters, Vol. 71, pp. 1798-1800.

67. Ju, Y.S., Kading, O.W., Leung, Y.K., Wong, S.S., and Goodson, K. E., 1997, "Short-Timescale Thermal Mapping of Semiconductor Devices," IEEE Electron Device Letters, Vol. 18, pp. 169-171.

68. Leung, Y.-K., Paul, A.K., Goodson, K.E., Plummer, J.D., and Wong, S.S., 1997, "Heating Mechanisms of LDMOS and LIGBT in Ultrathin SOI," IEEE Electron Device Letters, Vol. 18, pp. 414-416.

69. Goodson, K.E., and Asheghi, M., 1997, "Near-Field Optical Thermometry," Microscale Thermophysical Engineering, Vol. 1, pp. 225-235.

70. Ju, Y.S., and Goodson, K.E., 1997, "Size Effect on the Thermal Conductivity of Silicon-on-Insulator Devices under Electrostatic Discharge (ESD) Conditions," Japanese Journal of Applied Physics, Part 2, Letters, Vol. 36, pp. L798-L800.

71. Goodson, K.E., Kurabayashi, K., and Pease, R.F.W., 1997, "Improved Heat Sinking for Laser-Diode Arrays using Microchannels in CVD Diamond," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. B20, pp. 104-109.

72. Chen, G., Goodson, K.E., Grigoropoulos, C., Hipwell, M.C., Liepmann, D., Majumdar, A., Maruyama, S., Thundat, T., Tien, C.L., Tien, N.C., 1997, "Report of Workshop: Thermophysical Phenomena in Microscale Sensors, Devices, and Structures," Microscale Thermophysical Engineering, Vol. 1, pp. 267-274.

73. Goodson, K.E., 1996, "Thermal Conduction in Nonhomogeneous CVD Diamond Layers in Electronic Microstructures," ASME Journal of Heat Transfer, Vol. 118, pp. 279-286.

74. Goodson, K.E., Kading, O.W., Rosler, M. and Zachai, R., 1995, "Thermal Conduction normal to Diamond-Silicon Boundaries, " Applied Physics Letters, Vol. 66, pp. 3134-3136.

75. Goodson, K.E., Kading, O.W., Rosler, M. and Zachai, R., 1995, "Experimental Investigation of Thermal Conduction normal to Diamond-Silicon Boundaries," Journal of Applied Physics, Vol. 77, pp. 1385-1392.

76. Goodson, K.E., Flik, M.I., Su, L.T., and Antoniadis, D.A., 1995, "Prediction and Measurement of Temperature Fields in Silicon-on-Insulator Electronic Circuits," ASME Journal of Heat Transfer, Vol. 117, pp. 574-581.

77. Kading, O.W., Skurk, H., and Goodson, K.E., 1994, "Thermal Conduction in Metallized Silicon-Dioxide Layers on Silicon," Applied Physics Letters, Vol. 65, pp. 1629-1631.

78. Su, L.T., Chung, J.E., Antoniadis, D.A., Goodson, K.E., and Flik, M.I., 1994, "Measurement and Modeling of Self-Heating in SOI nMOSFETS," IEEE Transactions on Electron Devices, Vol. 41, pp. 69-75.

79. Goodson, K.E., and Flik, M.I., 1994, "Thermal Conduction Processes with Sub-Micrometer Lengthscales in Electronic Circuits," Thermal Science and Engineering, Vol. 2, pp. 191-201.

80. Goodson, K.E., and Flik, M.I., 1994, "Solid-Layer Thermal-Conductivity Measurement Techniques," Applied Mechanics Reviews, Vol. 47, pp. 101-112.

81. Goodson, K.E., Flik, M.I., Su, L.T., and Antoniadis, D.A., 1994, "Prediction and Measurement of the Thermal Conductivity of Amorphous Dielectric Layers," ASME Journal of Heat Transfer, Vol. 116, pp. 317-324.

82. Goodson, K.E., Flik, M.I., Su, L.T., and Antoniadis, D.A., 1993, "Annealing-Temperature Dependence of the Thermal Conductivity of LPCVD Silicon-Dioxide Layers," IEEE Electron Device Letters, Vol. 14, pp. 490-492.

83. Goodson, K.E., and Flik, M.I., 1993, "Electron and Phonon Thermal Conduction in Epitaxial High-Tc Superconducting Films," ASME Journal of Heat Transfer, Vol. 115, pp. 17-25.

84. Flik, M.I., Zhang, Z.Z., and Goodson, K.E., 1993, "Intrinsic Superconducting Radiation Detector," Applied Physics Letters, Vol. 62, pp. 2862-2864.

85. Goodson, K.E., and Flik, M.I., 1992, "Effect of Microscale Thermal Conduction on the Packing Limit of Silicon-on-Insulator Electronic Devices," IEEE Trans. Components, Hybrids, and Manufacturing Technology, Vol. 15, pp. 715-722.

86. Flik, M.I., Zhang, Z.M., Goodson, K.E., Siegal, M.P., and Phillips, J.M., 1992, "The Electron Scattering Rate in Epitaxial YBa2Cu3O7 Superconducting Films," Physical Review B, Vol. 46, pp. 5606-5614.

87. Flik, M.I., Choi, B.I., and Goodson, K.E., 1992, "Heat Transfer Regimes in Microstructures," ASME Journal of Heat Transfer, Vol. 114, pp. 666-674.

88. Flik, M.I., and Goodson, K.E., 1992, "Thermal Analysis of Electron-Beam Absorption in Low-Temperature Superconducting Films," ASME Journal of Heat Transfer, Vol. 114, pp. 264-270.

C. Papers in Conference and Symposium Proceedings - Refereed

1. Lee, E. S., Hidrovo, C. H., Steinbrenner, J. E., Wang, F.-M., Vigneron, S., Eaton, J. K. and Goodson, K. E., 2005, "Flow Structures and Frictional Characteristics on Two-Phase Flow in Microchannels in PEM Fuel Cells", FEDSM2005: 2005 ASME Fluids Engineering Summer Conference, June 19-23, Houston, Texas.

2. R. Flynn, T.A. Kramer, J.-M. Koo, D.W. Fogg, C.-H. Cheng, E.N. Wang, K.E. Goodson, 2005, "Convective Boiling in Silicon Microchannels with Localized Heating and Thermometry," 3rd International Conference on Microchannels & Minichannels, Toronto, Canada, June 13-15, ICMM2005-75209.

3. Wang, F.-M., Steinbrenner, J. E., Hidrovo, C. H., Kramer, T. A., Lee, E. S., Vigneron, S., Cheng, C.-H., Eaton, J. K. and Goodson, K.E., 2005, "Investigation of Two-Phase Transport Phenomena in Microchannels Using a Microfabricated Experimental Structure", Heat SET 2005: Heat Transfer in Components and Systems for Sustainable Energy Technologies, April 5-7, Grenoble, France.

4. Steinbrenner, J. E., Hidrovo, C. H., Wang, F.-M., Lee, E. S., Vigneron, S., Kramer, T. A., Cheng, C.-H., Eaton, J. K. and Goodson, K. E., 2005, "Measurement and Modeling of Liquid Film Thickness Evolution in Stratified Two-Phase Microchannel Flows," Heat SET 2005: Heat Transfer in Components and Systems for Sustainable Energy Technologies, April 5-7, Grenoble, France.

5. C.H. Hidrovo, T.A. Kramer, E.N. Wang, S. Vigneron, J.E. Steinbrenner, J.-M. Koo, F.-M. Wang, D. Fogg, R. Flynn, E.S. Lee, C.-H. Cheng, T.W. Kenny, J.K. Eaton, K.E. Goodson, 2005, "Two-phase Microfluidics for Semiconductor Circuits and Fuel Cells," 3rd International Conference on Microchannels & Minichannels, Toronto, Canada, June 13-15, ICMM2005-75085.

6. E. Pop, D. Mann, J. Reifenberg, K.E. Goodson and H. Dai, 2005, "Electro-Thermal Transport in Metallic Single-Wall Carbon Nanotubes for Interconnect Applications," International Electron Devices Meeting, Washington, DC

7. J. Rowlette, E. Pop, S. Sinha, M. Panzer and K.E. Goodson, 2005, "Thermal Phenomena in Deeply Scaled MOSFETs," Proceedings of the International Electron Devices Meeting,, Dec. 2005, Washington, DC

8. J. Rowlette, E. Pop, S. Sinha, M. Panzer, and K.E. Goodson, 2004, "Thermal Simulation Techniques for Nano-Transistors," Proceedings of the ICCAD Conference, Nov. 2005, San Jose CA.

9. J. Rowlette, E. Pop, S. Sinha, R. W. Dutton and K.E. Goodson, 2005, "Coupled Electron-Phonon Transport in Nanometer-Scale Silicon Devices," Proceedings of SRC TechCon, Portland OR.

10. E. Pop, J. Rowlette, R. W. Dutton and K. E. Goodson, 2005, "Joule Heating under Quasi-Ballistic Transport Conditions in Bulk and Strained Silicon Devices," Proceedings SISPAD, Tokyo, Japan.

11. Sinha, S., and Goodson, K.E., 2004, "Thermal conduction in sub-100 nm transistors," Keynote paper, Thermal Investigations of ICs and Systems (THERMINIC), Sophia Antipolis, France.

12. E. Pop, C. O. Chui, S. Sinha, R. W. Dutton, K. E. Goodson, 2004, "Electro-Thermal Comparison and Performance Optimization of Thin-Body SOI and GOI MOSFETs," International Electron Devices Meeting, San Francisco, CA.

13. S. Sinha, E. Pop, K. E. Goodson, 2004, "A Split-Flux Model for Phonon Transport Near Hotspots," Proceedings of the International Mechanical Engineering Congress and Exposition, Anaheim, CA.

14. T.A. Kramer, R.D. Flynn, D.W. Fogg, E.N. Wang, C.H. Hidrovo, R.S. Prasher, D.S. Chau, S. Narasimhan, K.E. Goodson. "Microchannel Experimental Structure for Measuring Temperature Fields During Convective Boiling," ASME International Mechanical Engineering Congress & Exposition, Anaheim, CA, USA, November 13-19, 2004, IMECE2004-61936.

15. Hu, X., Padilla, A., and Goodson, K., "Thermal Characterization of Vertically-Oriented Carbon Nanotubes on Silicon," SEMI-THERM, March 15-17, 2005, San Jose, CA

16. Hu, X., Goodson, K., "Lattice Boltzmann Simulation of Heat Conduction in Nanofluids," Proc. Materials Research Society Spring Meeting, March 30-April 1, 2005, San Francisco.

17. Hu, X., Prasher, R., and Goodson, K., "Thermal Conduction Phenomena in Advanced Interface Materials for Electronics Cooling", ASME National Heat Transfer Conference, July 17-22, 2005, San Francisco, CA

18. Hu, X., Jain, A., Goodson, K., "Investigation of the Natural Convection Boundary Condition in Microfabricated Structures," NHTC, July 17-22, 2005, San Francisco, CA.

19. Singaravelu, S., Hu, X., Goodson, K., "Bond Line Thickness of Thermal Interface Materials with Carbon Nanotubes," InterPack, July 17-22, 2005, San Francisco, CA

20. Hu, X., Panzer, M., Goodson, K., "Thermal Characterizing of Two Opposing Carbon Nanotube Arrays Using Diffraction Limited Infrared Microscopy," to be presented in ASME IMECE, November 5-11, 2005, Orlando, Fl

21. Hidrovo, C. H., Wang, E.-M., Steinbrenner, J. E., Lee, E. S., Vigneron, S., Cheng, C.-H., Eaton, J. K. and Goodson, K. E., "Water Slug Detachment in Two-Phase Hydrophobic Microchannel Flows", ICMM2005: 3rd International Conference on Microchannels and Minichannels, June 13-15, 2005, Toronto, Ontario, Canada.

22. Hidrovo, C. H., Wang, F.-M., Lee, E. S., Vigneron, S., Steinbrenner, J. E., Paidipati, J. V., Kramer, T. A., Eaton, J. K. and Goodson, K. E., "Experimental Investigation and Visualization of Two-Phase Flow and Water Transport in Microchannels", IMECE04: ASME 2004 International Mechanical Engineering Conference, November 13-19, 2004, Anaheim, CA.

23. Vigneron, S., Hidrovo, C. H., Wang, F.-M., Lee, E. S., Steinbrenner, J. E., Paidipati, J. V., Kramer, T. A., Eaton, J. K. and Goodson, K. E., "1D Homogeneous Modeling of Microchannel Two-Phase Flow with Distributed Liquid Water Injection from Walls", IMECE04: ASME 2004 International Mechanical Engineering Conference, November 13-19, 2004, Anaheim, CA.

24. Fogg, D., Flynn, R., Hidrovo, C., Zhang, L. and Goodson, K., "Fluorescent Imaging of Void Fraction in Two-Phase Microchannels", 3rd International Symposium on Two-Phase Flow Modeling and Experimentation, September 22-24, 2004, Pisa, Italy.

25. E.N. Wang, J.G. Santiago, K.E. Goodson, T.W. Kenny. "Microjet Impingement Cooling with Phase Change," ASME International Mechanical Engineering Congress & Exposition, November 13-19, 2004, Anaheim, CA, USA, IMECE2004-62176.

26. E. Pop, K. E. Goodson, R. W. Dutton, "Thermal Analysis of Ultra-Thin Body Device Scaling," Proceedings of the International Electron Devices Meeting, Dec. 2003, Washington DC.

27. E. Pop, K. E. Goodson, R. W. Dutton, 2003, "Detailed Heat Generation Simulations via the Monte Carlo Method," Proceedings of SISPAD, Sep. 2003, Boston MA.

28. E. Pop, K. E. Goodson, R. W. Dutton, "Monte Carlo Simulation of Heat Generation in Silicon Nano-Devices," SRC TechCon, Aug. 2003, Dallas TX (Best Paper in Session Award)

29. E.N. Wang, S. Devasenathipathy, J.G. Santiago, K.E. Goodson, T.W. Kenny. "Nucleation and Growth of Vapor Bubbles in a Heated Silicon Microchannel," ASME International Mechanical Engineering Congress & Exposition, Washington, D.C., USA, Nov. 15-21, 2003.

30. E.N. Wang, S. Devasenathipathy, C.H. Hidrovo, D.W. Fogg, J.-M. Koo, J.G. Santiago, K.E. Goodson, T.W. Kenny. "Liquid Velocity Fields in Two-Phase Microchannel Convection," 3rd International Symposium on Two-Phase Flow Modelling and Experimentation, September 22-24, 2004, Pisa, Italy.

31. Sinha, S., Schelling, P.K., Phillpot, S.R., and Goodson, K.E., "Atomistic simulations of g-type phonons in silicon devices," ASME Heat Transfer/ Fluids Engineering Summer Conference, July 11-15 2004, Charlotte, North Carolina, USA.

32. Sinha, S., Schelling, P.K., Phillpot S.R., and Goodson, K.E., "Nanoscale simulation of heat conduction in semiconductor devices," The Ninth Intersociety Conference on Thermal and Thermo-mechanical Phenomena In Electronic Systems, June 1-4 2004, Las Vegas, Nevada, USA.

33. Sinha, S., Schelling, P.K., Phillpot S.R., and Goodson, K.E., "Atomistic simulations of non-equilibrium phonons in nanotransistors," Proceedings of the Semiconductor Research Corporation - TECHCON, August 2003, Dallas, Texas, USA.

34. McConnell, A.D., L. Jiang, K. E. Goodson, "A Method for Measuring the Thermal Conductivity of Individual Carbon Nanotubes," manuscript prepared for the Proceedings of the NSF Design, Service and Manufacturing Grantees and Research Conference, Dallas, TX, September, 2004.

35. Jain, A., Ness, K., McConnell, A., Jiang, L., Goodson, K.E., "Design, fabrication and thermal characterization of a MEMS device for control of nerve cell growth." Proceedings of IMECE-2003, Washington D.C., Nov 16-21, 2003.

36. Jain, A., Ness, K., McConnell, A., Jiang, L., Goodson, K.E.. "Microfabrication and cell culturing on a large temperature gradient microdevice for studying nerve cell growth." Proceedings of NSF DSM Grantees and Research Conference, Dallas, TX, Jan. 5-8, 2004.

37. Jain, A., Ness, K., Mehenti, N., Fishman, H., Goodson, K.E.. "A microheater device for study of temperature gradient effects on neurite outgrowth in retinal ganglion cells." ARVO Annual Meeting 2004, Ft. Lauderdale, FL, April 25-28, 2004.

38. Sinha, S., Pop E., and Goodson, K.E., 2004, "A Split-Flux Model for Phonon Transport Near Hotspots," Proceedings of the International Mechanical Engineering Congress and Exposition, Anaheim, CA.

39. Ness, K., Wheeler E., Benett, W., Stratton. P., Christian, A., Chen, A., Weisgrabber, T., Goodson, K.. "Buoyancy-driven polymerase chain reaction (PCR) devices," Proceedings of ECI: Transport Phenomena in Micro and NanoDevices, Kona, Hawaii, 2004.

40. Candler, R.N., Hopcroft, M., Park, W.T., Chandorkar, S.A., Yama, G., Goodson, K.E., Varghese, M., Duwel, A., Partridge, A., Lutz, M., and Kenny, T.W., "Reduction in Thermoelastic Dissipation in Micromechanical Resonators by Disruption of Heat Transport," Proceedings of Solid State Sensors and Actuators Workshop, pp. 45-48, 2004.

41. Hu, X., Govindasamy, S., Goodson, K.E., "Two-medium Model for the Bond Line Thickness of Particle Filled Thermal Interface Materials", Proceedings of the ASME IMECE, November 13-19, 2004, Anaheim, CA

42. Hu, X., Jiang, L., and Goodson, K.E., "Thermal Conductance Enhancement of Particle-Filled Thermal Interface Materials using Carbon Nanotube Inclusions", Proceedings of ITHERM, June 1-4, 2004, Las Vegas, NV

43. Hu, X., Jiang, L., and Goodson, K., "Thermal characterization of eutectic alloy thermal interface materials with void-like inclusions", Proceedings of the IEEE SEMI-THERM Conference, March 9-11, 2004, San Jose, CA.

44. Goodson K., Jiang L., Sinha S., Pop E., Im S., Fletcher D., King W., Koo, J. and Wang E., "Microscale thermal engineering of electronic systems," Invited Paper for the Proceedings of the Rohsenow Symposium on Future Trends of Heat Transfer, Massachusetts Institute of Technology, Cambridge, Massachusetts, May 16, 2003.

45. Chu, D., Bilir, D., Goodson, K.E., and Pease, R.F.W., 2003, "Thin Film Nano Thermocouple Sensors for Applications in Laser and Electron Beam Irradiation" presented at the 12th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers'03), Boston, MA, 2003, the corresponding paper published in the conference Proceeding, Vol. 2, pp. 1112.

46. Chu, D., Wong, W.K., Goodson, K.E., and Pease, R.F.W., "Transient Temperature Measurements of Resist Heating using Nano Thermocouples" presented at the 47th International Conference of Electron, Ion, Photon Beam Technology and Nanofabrication (EIPBN2003), Tampa, FL, 2003.

47. W.P. King and K.E. Goodson, "Modeling and Simulation of Nanometer-Scale Thermomechanical Nano-Indentation," ASME-JSME Joint Thermal Engineering Conference, March 2003, Hawaii, HI.

48. W.P. King and K.E. Goodson, "Resolution Limits of Nanoscale Thermal Processing with the Atomic Force Microscope," ASME IMECE 2002 Symposium on Thermal Issues in Nanomaterials and Nanofabrication, November 2002, New Orleans, LA.

49. Asheghi, M., Behkam, B., Keivan, Y., Joshi, R., and Goodson, K.E., 2002, "Thermal Conductivity Model for Silicon-on-Insulator Layers at High Temperatures," Proc. IEEE International SOI Conference, pp 51-52.

50. Koo, J.-M., Jiang, L., Bari, A., Zhang, L., Wang, E., Kenny, W., Goodson, K.E., and Santiago, J.G., "Convective Boiling in Microchannel Heat Sinks with Spatially-varying Heat Flux," Proceedings of ITHERM 2002, San Diego, CA, USA, May, 2002.

51. Jiang, L., Koo, J - M., Zhang, L., Wang, E., Im, S., Yao, S., Zeng, S., Goodson, K., and Bari, A., "Progress on Two-Phase Convection in Microchannel Heat Sinks," Invited Keynote Lecture, Paper appeared in the Proceedings of Forth Pacific Rim Thermal Science and Energy Engineering Workshop, Kyoto, Japan, May 31-June 2, 2002.

52. Jiang, L., Koo, J.-M., Bari, A., Wang, E., Prasher, R.S., Maveety, J., Kenny, T.W., Goodson, K.E., and Santiago J.G., 2002, "Cross-linked Microchannels for VLSI Hotspot Cooling," Proc. ASME International Mechanical Engineering Congress & Exposition, New Orleans, November 17-22.

53. Koo, J.-M., Im, S., Goodson, K.E., Cho, E., Prasher, R.S., Wang, E., Jiang, L., Bari, A., Campion, D., Fogg, D., Kim, M., Kenny, T.W., and Santiago, J.G., 2002, "VLSI Hotspot Cooling Using Two-phase Microchannel Convection," Proc. ASME International Mechanical Engineering Congress & Exposition, New Orleans, November 17-22, MEMS-1, IMECE2002-39238.

54. Pop, E., Sinha, S., and Goodson, K.E., 2002, "Monte Carlo Modeling of Heat Generation in Electronic Nanostructures," Proc. ASME International Mechanical Engineering Congress & Exposition, New Orleans, November 17-22.

55. Im, S., Goodson, K.E., and Banerjee, K., "Via Design and Scaling Strategy for Nanometer Scale Interconnect Technologies," Proc. IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, Dec. 9-11, pp. 587-590, 2002.

56. Koo, J., Im, S., Jiang, L., Goodson, K. E., 2003 "Integrated Microchannel Network for Cooling of 3D Circuit Architectures," Proceedings of ASME International Mechanical Engineering Congress & Exposition, Washington, D.C., Nov. 16-21, IMECE2003-42280.

57. Cross, G.L.W., Despont, M., Drechsler, U., Durig, U., Vettiger, P., King, W.P., and Goodson, K.E, 2001, "Thermomechanical Formation and Thermal Sensing of Nanometer-Scale Indentations in PMMA Thin Films for Parallel and Dense AFM Data Storage," Fundamentals of Nanoindentation and Nanotribology II, Materials Research Society Symposium Proceedings, 649.

58. Im, S., Banerjee, K., and Goodson, K.E., "Modeling and Analysis of Via Hot Spots and Implications for ULSI Interconnect Reliability," 40th IEEE Annual International Reliability Physics Symposium (IRPS), Dallas, TX, April 8-11, 2002.

59. Jiang, L., Mikkelsen, J., Koo, J-M, Zhang, L., Huber, D., Yao, S., Bari, A., Zhou, P., Santiago, J., and Kenny, T.W. and Goodson, K.E., "Transient and Sub-atmospheric Performance of A Closed-loop Electroosmotic Microchannel Cooling System", Proceeding of Thermal Challenges in Next Generation Electronic Systems, THERMES 2002, Santa Fe, New Mexico, USA, pp. 133-139, Jan. 13-16, 2002.

60. Wang, E.N., Zhang, L., Jiang, L., Koo, J.-M., Maveety, J., Sanchez, E.A., Goodson, K.E., Santiago, J.G., and Kenny, T.W., "Micromachined Jet Arrays for Liquid Impingement Cooling of VLSI Chips", Hilton Head 2002: Solid-State Sensors & Actuator Workshop, Hilton Head, South Carolina, June 2002.

61. Pop, E., Sinha S., and Dutton, R. and Goodson, K.E., "Nanoscale Heat Generation in Silicon via the Monte Carlo Method," US-Japan NANOTHERM Workshop, Berkeley, CA, 2002.

62. Jiang, L., Koo, J - M., Zhang, L., Wang, E., Im, S., Yao, S., Zeng, S., Goodson, K., and Bari, A., "Progress on Two-Phase Convection in Microchannel Heat Sinks," Invited Keynote Lecture, Proceedings of Forth Pacific Rim Thermal Science and Energy Engineering Workshop, Kyoto, Japan, May 31-June 2, 2002.

63. Im, S., and Banerjee, K., and Goodson, K.E., "Modeling and Analysis of Via Hot Spots and Implications for ULSI Interconnect Reliability," Proceedings of the 40th IEEE Annual International Reliability Physics Symposium (IRPS), Dallas, TX, April 7-11, pp. 336-345, 2002.

64. Zhang, L., Wang, E.N., Koo, J.-M., Jiang, L., Goodson, K.E., Santiago, J. G., and Kenny, T. W., "Enhanced Nucleate Boiling in Microchannels", 15th IEEE MEMS Workshop, Las Vegas, Nevada, USA, Jan. 20-24, 2002.

65. King, W.P., and Goodson, K.E., 2001, "Modeling and Simulation of Nanometer-Scale Thermomechanical Data Bit Formation," Proceedings of the ASME National Heat Transfer Conference, Anaheim, CA, June 10-12.

66. Zhang, L., Koo, J.-M., Jiang, L., Goodson, K.E., Santiago, J.G., and Kenny, T.W., 2001, "Study of Boiling Regimes and Transient Signal Measurements in Microchannels," Proc. Solid State Sensors and Actuators Workshop (Transducers), Munich, Germany, June, pp. 1514-1517.

67. Laser, D., Yao, S., Chen, C.H., Mikkelsen, J., Goodson, K.E., Santiago, J.G., and Kenny, T.W., 2001, "A Micromachined Silicon Low-Voltage Parallel-Plate Electrokinetic Pump," Proc. Solid State Sensors and Actuators Workshop (Transducers), Munich, Germany, p. 330.

68. McConnell, A.D., Uma, S., and Goodson, K.E., 2000, "Thermal Conductivity of Doped Polysilicon Layers," Proc. International Conference on Heat Transfer and Transport Phenomena in Microscale Structures, G. P. Celata et al., eds., Begell House, New York, pp. 413-419.

69. Zeighami, R.M., Laser, D., Zhou, P., Asheghi, M., Devasenathipathy, S., Kenny, T.W., Santiago, J.G., and Goodson, K.E., 2000, "Experimental Investigation of Flow Transition in Microchannels using Micron Resolution Particle Image Velocimetry," Proc. ITherm, Las Vegas, Nevada, May.

70. Zhou, P., and Goodson, K.E., 2000, "Thermomechanical Diagnostics of BGA Packages using Digital Image/Speckle Correlation (DISC)," Proc. ITherm, Las Vegas, Nevada, May.

71. Chu, D., Touzelbaev, M., Goodson, K.E., Babin, S., Pease, R.F., 2001, "Thermal Conductivity Measurements for Resist Thin Film," presented at the International Symposium on Electron, Ion and Photon Beam Technology and Nanofabrication, Washington DC.

72. Cross, G.L.W., Despont, M., Drechsler, U., Durig, U., Vettiger, P., King, W.P., and Goodson, K.E, 2001, "Thermomechanical Formation and Thermal Sensing of Nanometer-Scale Indentations in PMMA Thin Films for Parallel and Dense AFM Data Storage," Fundamentals of Nanoindentation and Nanotribology II, Materials Research Society Symposium Proceedings, 649.

73. Jiang, L., Koo, J.M., Zeng, S., Zhang, L., Banerjee S., Zhou P., Santiago J.G., Kenny T.W., Goodson K.E., 2001, "An Electrokinetic Closed-Loop Micro Cooler for High-Power VLSI Chips," presented at SEMI-THERM, San Jose, CA, USA, March.

74. Zhang, L., Koo, J.M., Jiang, L., Banerjee, S.S., Asheghi, M., Goodson, K.E., Santiago, J.G., Kenny, T.W., 2000, "Measurements and Modeling of Two-phase Flow in Mirochannels with Nearly-Constant Heat Flux Boundary Conditions," Proceedings of International Mechanical Engineering Congress & Exposition, Orlando, Florida, USA, November, pp. 129-135.

75. King, W.P., Santiago, J.G., Kenny, T.W., and Goodson, K.E., 1999, "Modeling and Simulation of Sub-Micrometer Heat Transfer in AFM Thermomechanical Data Storage," ASME MEMS-Vol. 1, pp. 583-588.

76. Touzelbaev, M.N., and Goodson, K.E, 2000, "Impact of Experimental Timescale and Geometry on Thin-Film Thermal Property Measurements," 14th Symposium on Thermophysical Properties, June.

77. K. Banerjee, D-Y Kim, A. Amerasekera, C. Hu, S. Wong, and K. E. Goodson, 2000, "Microanalysis of VLSI Interconnect Failure Modes under Short-Pulse Stress Conditions," Proceedings of the 38th Annual IEEE International Reliability Physics Symposium, April 10-13, San Jose, CA, pp. 283-288.

78. K. Banerjee, A. Mehrotra, W. H. Hunter, K. C. Saraswat, K. E. Goodson, and S. Wong, 2000, "Quantitative Projections of Reliability and Performance for Low-k/Cu Interconnect Systems," Proc. of the 38th Annual IEEE International Reliability Physics Symposium, April 10-13, San Jose, CA, pp. 354-358

79. Sverdrup, P. G., Ju, Y. S., and Goodson, K. E., (1999), "Sub-Continuum Simulations of Heat Conduction in Silicon-on-Insulator Transistors," Proc. ASME IMECE, Nashville, TN, HTD-Vol. 364-3, pp. 41-49.

80. Chui, B.W., Asheghi, M., King, B.W., Kenny, T.W., and Goodson, K.E., "Thermal Engineering of Doped Single-Crystal Silicon MicroCantilevers for High Density Data Storage," to be presented at Transducers '99, Japan, December 12-18.

81. Goodson, K.E., "Microscale Thermal Engineering of Integrated Circuits," to be presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference (InterPACK '99), Maui, Hawaii, June 13-19.

82. Zhou, P., and Goodson, K.E., 1999, "Diagnostics of FLIP-CHIP/BGA Structures using Phase-Shifting Speckle-Pattern Interferometry," Proc. Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference (InterPACK '99), Maui, Hawaii, June 13-19.

83. Asheghi, M., Kurabayashi, K., Goodson, K.E., Kasnavi, R., and Plummer, J.D., 1999, "Thermal Conduction in Doped Silicon Layers," accepted for the 33rd ASME/AIChE National Heat Transfer Conference, Albuquerque, NM, August 8-14.

84. Ju, Y.S., and Goodson, K.E., 1999, "Measurements of the Thermal Conductivity of Monocrystalline Silicon Films," accepted for the 33rd ASME/AIChE National Heat Transfer Conference, Albuquerque, NM, August 8-14.

85. Kurabayashi, K., and Goodson, K.E., 1999, "Prediction of the Thermal Conductivity Anisotropy in Linear-Chain Polymer Films," accepted for the ASME/JSME Thermal Engineering Joint Conference, San Diego, CA, March 15-19.

86. Kurabayashi, K., Asheghi, M., Touzelbaev, M.N., and Goodson, K.E., 1998, "Measurement of the Thermal Conductivity Anisotropy in Polymer Films," Proceedings of the 1998 International Mechanical Engineering Congress and Exposition, Anaheim, California, November 15-20, S. Liu et al., eds.

87. Kurabayashi, K., Touzelbaev, M.N, Asheghi, M., Ju, Y.S., and Goodson, K. E., 1998, "Measurement of the Anisotropic Thermal Conductivities in Polymer Films," Proceedings of the 7th AIAA/ASME Joint Thermophysics and Heat Transfer Conference, Albuquerque, NM, June 14-18, B.F. Armaly et al., eds., Vol. 3, pp.187-194.

88. Ju, Y.S., and Goodson, K.E., 1997, "Impact of Phonon Dispersion upon the Size Effect on Thermal Conduction along Thin Semiconductor Films," Proceedings of the 1997 International Mechanical Engineering Congress and Exposition, Dallas, Texas, November 16-21, in Microscale Energy Transport, K.E. Goodson et al., eds., HTD-Vol. 354, pp. 181-190.

89. Schuder, R.G., and Goodson, K.E., 1997, "Integrated Circuits and MicroElectroMechanical Systems in the Heat Transfer Teaching Laboratory," ASME Proceedings of the 32nd National Heat Transfer Conference, Baltimore, Maryland, August 7-10, in Innovations in Heat Transfer Education, HTD-Vol. 344, M. Bianchi et al., eds., pp. 83-92.

90. Kurabayashi, K., and Goodson, K.E., 1997, "Precision Measurement and Mapping of Die-Attach Thermal Resistance," Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, Kohala Coast, Hawaii, June 15-19, in Advances in Electronic Packaging, EEP Vol. 19-1, E. Suhir et al., eds., pp. 2023-2030.

91. Ju, Y.S., and Goodson, K.E., 1997, "Short-Timescale Thermal Mapping of Interconnects," Proceedings of the 35th IEEE International Reliability Physics Symposium, Denver, Colorado, April 8-10, IEEE Catalog No. 97CH35983, pp. 320-324.

92. Ju, Y.S., and Goodson, K.E., 1996, "Short-Timescale Thermometry and Reliability Studies of Metal Interconnects in VLSI Circuits," Proceedings of the International Mechanical Engineering Congress and Exposition, Atlanta, GA, November 17-22, in Micro-Electro-Mechanical Systems (MEMS), DSC-Vol. 59, C. T. Avedisian et al., eds., pp. 31-36.

93. Asheghi, M., Touzelbaev, M.N., Goodson, K.E., Leung, Y.K., and Wong, S.S., 1996, "Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates," Proceedings of the International Mechanical Engineering Congress and Exposition, Atlanta, GA, November 17-22, DSC-Vol. 59, in Micro-Electro-Mechanical Systems (MEMS), C. T. Avedisian et al., eds., pp. 83-91.

94. Touzelbaev, M.N., and Goodson K.E., 1996, ""Impact of Nucleation Density on the Thermal Resistance near Diamond-Substrate Boundaries," Proceedings of the ASME/AIChE National Heat Transfer Conference, Houston, Texas, August 3-6, Vol. 5, R. L. Mahajan et al., eds., pp. 193-200.

95. Goodson, K.E., Ju., Y.S., Asheghi, M., Kading, O.W., Touzelbaev, M.N., Leung, Y.K., and Wong, S.S., 1996, "Microscale Thermal Characterization of High-Power Silicon-on-Insulator Transistors," Proceedings of the 31st ASME National Heat Transfer Conference, Houston, Texas, August 3-6, Vol. 5, R. L. Mahajan et al., eds., pp. 1-9.

96. Goodson, K.E., and Touzelbaev, M. N., 1995, "Effective Thermal Resistance at Diamond Boundaries in MEMS," presented at the Micromechanical Systems Panel Symposium at the ASME International Congress and Exposition, San Francisco, California, November 12-17, in Proceedings of the ASME Dynamic Systems and Control Division, DSC-Vol. 57-2, T.E. Alberts, ed., ASME Press., New York, pp. 925-930.

97. Goodson, K.E., Kurabayashi, K., and Pease, R.F.W., 1995, "Improved Heat Sinking for Laser-Diode Arrays using Microchannels in CVD Diamond," Proceedings of the 1995 National Heat Transfer Conference, Portland, Oregon, August 5-9, ASME HTD-Vol. 305, S. S. Sadhal et al., eds, pp. 187-192.

98. Goodson, K.E., 1995, "Thermal Conduction in Nonhomogeneous CVD Diamond Layers in Electronic Microstructures," Proceedings of the Fourth ASME/JSME Thermal Engineering Joint Conference, Maui, Hawaii, March 19-24, L. S. Fletcher and T. Aihara, eds., Vol. 4., pp. 175-182.

99. Goodson, K.E., Kading, O.W., and Zachai, R., 1994, "Thermal Resistances at the Boundaries of CVD Diamond Layers in Electronic Systems," Proceedings of the ASME International Mechanical Engineering Conference and Exposition, Chicago, Illinois, November 7-11, in Heat Transfer in Electronic Systems, R. A. Wirtz et al., eds., ASME HTD-Vol. 292, pp. 83-94.

100. Goodson, K.E., Flik, M.I., Su, L.T., and Antoniadis, D.A., 1993, "Annealing-Temperature Dependence of the Thermal Conductivity of CVD Silicon-Dioxide Layers," Proceedings of the 29th ASME National Heat Transfer Conference, Atlanta, GA, August 8-11, in Heat Transfer on the Microscale, F. M. Gerner and K. S. Udell, eds., ASME HTD-Vol. 253, pp. 21-28.

101. Goodson, K.E., Flik, M.I., Su, L.T., and Antoniadis, D.A., 1993, "Prediction and Measurement of Temperature Fields in Silicon-on-Insulator Electronic Circuits," Proceedings of the 29th ASME National Heat Transfer Conference, Atlanta, GA, August 8-11, in Solutions to CFD Benchmark Problems in Electronic Packaging, D. Agonafer, ed., ASME HTD-Vol. 255, pp. 11-19.

102. Goodson, K. E., and Flik, M. I., 1992, "Effect of Microscale Thermal Conduction on the Packing Limit of Silicon-on-Insulator Electronics," Proceedings of the Third Intersociety Conference on Thermal Phenomena in Electronic Systems, Austin, TX, February 5-8, A. Ortega and S. Oktay, eds., IEEE Catalog Number 92CH3096-5, pp. 122-126.

103. Goodson, K.E., and Flik, M.I., 1992, "Microscale Phonon Transport in Dielectrics and Intrinsic Semiconductors," Proceedings of the ASME Winter Annual Meeting, Anaheim, CA, November 8-13, in Fundamental Issues in Small Scale Heat Transfer, Y. Bayazitoglu and G.P. Peterson, eds., HTD-Vol. 227, pp. 29-36.

104. Flik, M.I., Choi, B. I., and Goodson, K.E., 1991, "Heat Transfer Regimes in Microstructures," Proceedings of the ASME Winter Annual Meeting, December 1-6, Atlanta, GA, in Micromechanical Sensors, Actuators, and Systems, D. Cho et al., eds., pp. 31-47.

105. Goodson, K.E., and Flik, M.I., 1991, "Electron and Phonon Thermal Conduction in Epitaxial High-Tc Superconducting Films," Proceedings of the ASME National Heat Transfer Conference, Minneapolis, MN, July 28-31, in Cryogenic Heat Transfer, A. S., Adorjan, ed., pp. 76-89.

106. Flik, M.I., and Goodson, K.E., 1991, "Thermal Analysis of Electron-Beam Absorption in Low-Temperature Superconducting Films," Proceedings of the Third ASME/JSME Joint Thermal Engineering Conference, Reno, Nevada, March 17-22, Vol. 2., pp. 29-42.

D. Papers in Conference and Symposium Proceedings - Not Refereed

1. Chu, D. Goodson, K.E., and Pease, F., 2002, "Modeling Resist Heating in Mask Fabrication Using A Green's Function Approach" Proc. SPIE, Vol. 4689, pp. 206.

2. Koo, J.M., Im, S., Banerjee, S.S., Fogg, D., Wang, E., Zhang, L., Jiang, L., Bari, A., Kenny, T.W., Goodson, K.E., and Santiago, J.G., Two-phase Microchannel Heat Sinks for Sub-100nm High Performance VLSI,・Proc. ISLPED.

3. King, W.P., and Goodson, K.E., 2001, Thermal Writing and Nanoimaging with Heated Atomic Force microscope Cantilevers,・presented at the Heat Transfer Photogallery at the ASME International Mechanical Engineering Congress and Exposition, November 12-16.

4. Fletcher, D.A., Webb, N.U., Kino, G.S., Quate, C.F., and Goodson, K.E., 2001, "Thermal Microscopy with a Microfabricated Solid Immersion Lens," Proc. IEEE/LEOS International Conference on Optical MEMS, Okinawa, Japan.

5. King, W.P., and Goodson, K.E., 2002, "Modeling Sub-Continuum Effects on the Mechanical Properties of Ultrathin Macromolecular Layers," invited paper, Conference on the Modeling and Simulation of Microsystems, San Juan, Puerto Rico, April 20-22.

6. Sverdrup, P. G., Banerjee, K., Dai, C., Shih, W.K., Dutton, R. W., and Goodson, K. E., 2000, "Sub-Continuum Thermal Simulations of Deep Sub-Micron Devices Under ESD Conditions," International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 54-57.

7. Fletcher, D.A., Crozier, K.B., Kino, G.S., Quate, C.F., and Goodson, K.E., 2000, "Scanning Refractive Microlens," Technical Digest of the Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 263-265.

8. Fletcher, D.A., Simanovskii, D., Palanker, D.V., Crozier, K.B., Quate, C.F., Kino, G.S., and Goodson, K.E., 2000, "Microfabricated Solid Immersion Lens with Metal Aperture," Proc. IEEE/LEOS International Conference on Optical MEMS, Kauai, Hawaii.

9. Koo, J.M., Jiang, L., Zhang, L., Zhou, P., Banerjee, S., Santiago, J.G., Kenny, T.W., and Goodson, K.E., 2001, 溺odeling of Two-Phase Microchannel Heat Sinks for VLSI Chips・ Proc. 14th IEEE Conference on MEMS 2001, Interlaken, Switzerland, Jan 21-25, pp. 422-426.

10. Zhang L., Banerjee S.S., Koo J.M., Laser D.J., Asheghi M., Goodson K.E., Santiago J.G., Kenny T.W., 2000, "A Micro Heat Exchanger with Integrated Heaters and Thermometers," Proc. Hilton Head Solid-State Sensor & Actuator Workshop, Hilton Head, South Carolina, June 4-8.

11. King, W.P., Kenny, T.W., Goodson, K.E., Cross, G., Despont, M., Drechsler, U., D・ig, U., H臙erle, W., Lutwyche, M., Rothuizen, H., Stutz, R., Widmer, R., Binnig, G.K., and Vettiger, P. 泥esign of AFM Cantilevers for Combined Thermomechanical Data Writing and Reading,・Proc. of the Hilton Head Solid-State Sensors and Actuators Workshop, pp. 1-5, 2000.

12. Sverdrup, P.G., Tornblad, O., Banerjee, K., Yergeau, D., Yu, Z., Dutton, R.W., and Goodson, K.E., 2000, "Advanced Electro-Thermal Modeling and Simulation Techniques for Deep Sub-Micron Devices," Proc. TechCon, Phoenix, AZ, September 21-23.

13. Tornblad, O., Sverdrup, P. G., Yergeau, D., Yu, Z., Goodson, K. E., and Dutton, R. W., 2000, "Modeling and Simulation of Phonon Boundary Scattering in PDE-based Device Simulators," Proc. International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 58-61.

14. Sverdrup, P.G., Ju, Y.S., and Goodson, K.E., 1999, 的mpact of Heat Source Localization on Conduction Cooling of Silicon-on-Insulator Devices," Proc. International Conference on Modelling and Simulation of Microsystems, Puerto Rico, April 19-22.

15. Sverdrup, P.G., Kurabayashi, K., Ju, Y.S., Shieh, B.P., and Goodson, K.E., 1998, "Thermal Reliability Problems Posed by Novel Dielectrics," Proc. 15th International VLSI Multilevel Interconnection Conference (VMIC), Santa Clara, CA, June 16-18, VMIC Catalog No. 98 IMIC - 108, pp. 261-266.

16. Kurabayashi, K., Touzelbaev, M.N., Asheghi, M., Ju, Y.S., and Goodson, K.E., 1997, 溺easurement of the Anisotropic Thermal Conductivity in Polymer Thin Films for Low-Dielectric-Constant Passivation,・Proc. 3rd International Workshop on Thermal Investigations of ICs and Microstructures, Cannes, France, September 21-23.

17. Asheghi, M., Ju, Y.S., and Goodson, K.E., 1997, 典hermal Conductivity of SOI Device Layers,・Proceedings of the IEEE International SOI Conference, Tenaya Lodge at Yosemite, Fish Camp, California, October 6-9, IEEE Vol. 97CH36069, pp. 134-135.

18. Chui, B.W., Goodson, K.E., Kenny, T.W., Mamin, H.J., Terris, B.D, and Rugar, D. "Micromachined heaters with 1-us thermal time constants for AFM thermomechanical data storage," Proceedings of the International Conference on Solid-state Sensors and Actuators, Transducers, Chicago, Illinois, June, 1997.

19. Chui, B.W., Stowe, T.D., Ju, Y. S., Soh, H.T., Minne, S.C., Goodson, K.E., Quate, C.F., Kenny, T.W., Mamin, H.J., Terris, B.D., Ried, R.P., and Rugar, D., 1996, 的mproved Cantilevers for AFM Thermomechanical Data Storage,・Proceedings of the Solid-State Sensor and Actuator Workshop, Hilton Head, South Carolina, June 2-6, pp. 219-224.

20. Goodson, K.E., and Cooper P.T., 1995, "The Effect of High-Energy Electrons on Lattice Conduction in Semiconductor Devices," Proceedings of the Symposium on Thermal Science and Engineering in Honor of Chancellor Chang-Lin Tien, Berkeley, California, November 14, R. Buckius, ed., pp. 153-159.

21. Leung, Y.-K., Suzuki, Y., Goodson, K.E., and Wong, S.S., 1995, "Self-Heating Effect in Lateral DMOS on SOI," Proceedings of the Seventh International Symposium on Power Devices and Integrated Circuits, H. Ahashi, Y. Uchida, and Y. Sugawara, eds., Yokohama, Japan, May 23-25, pp. 136-140.

22. Flik, M.I., and Goodson, K.E., 1992, "Impact of Microscale Heat Conduction on the Design of Silicon-on-Insulator Electronic Circuits," Proceedings of the NSF/DITAC Collaborative Workshop on Thermal Conductance Enhancement in Microelectronics, Clayton, Australia, May 4-7, T.N. Veziroglu et al., eds., pp. 79-86.

E. Patents

1. Electroosmotic Microchannel Cooling System (Assigned to Stanford University), K.E. Goodson, D.E. Huber, L. Jiang, T.W. Kenny, J-M Koo, J.C. Mikkelsen, J.G. Santiago, E. Wang, S. Zheng, L. Zhang, D. Laser, H. Chen, Issued September 13, 2005, US Patent 6,942,018.

2. Composite Thermal Interface Material Including Particles and Nanofibers (Assigned to Stanford University), X. Hu, L. Jiang, and K. E. Goodson, pending.

3. Electroosmotic micropumps with planar features (Assigned to Stanford University), Chuan-Hua Chen, Kenneth E. Goodson, Thomas W Kenny, Daniel J. Laser, Juan G. Santiago, pending..

Last Update: Fall 2005.
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