Stanford Microscale Heat Transfer Lab: Archival Journal Publications

GOODSON GROUP PUBLICATIONS

1. Archival Journal Publications
(Current Group Members and Group Alumni in Bold)

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			2008	2007
2006	2005	2004	2003	2002
2001	2000	1999	1998	1997
1996	1995	1994	1993	1992

2008

110.	Chandorkar, S.A., R. N. Candler, A. Duwel, R. Melamud, M. Agarwal, K. E. Goodson, and T. W. Kenny, "Multi-Mode Thermoelastic Dissipation," submitted to the Journal of Applied Physics.

109.	Fang, C., Hidrovo, C., Wang, F.M., Eaton, J.K., and Goodson, K.E., 2007, "3D Numerical Simulation of Contact Angle Hysteresis for Microscale Two-Phase Flow," International Journal of Multiphase Flow, in press.

108.	Kolade, B., Goodson, K.E., and Eaton, J.K., 2008, "Convective Performance of Nanofluids in a Laminar Thermally-Developing Tube Flow," ASME Journal of Heat Transfer, in press.

107.	Pettes, A.M., Hodes, M.S., Goodson, K.E., 2008, "Optimized Thermoelectric Refrigeration in the Presence of Thermal Boundary Resistance," IEEE Transactions on Advanced Packaging, in press.

106.	Fogg, D.W., Milnes, D., and Goodson, K.E., 2008, "Non-Invasive Measurement of Void Fraction and Liquid Temperature in Microchannel Flow Boiling," International Journal of Heat and Mass Transfer, in press.

105.	Fogg, D.W., and Goodson, K.E., "Bubble-Induced Water Hammer in Microchannel Flow Boiling," ASME Journal of Heat Transfer, in press.

104.	Rowlette, J.A., and Goodson, K.E., 2008, "Fully-Coupled, Nonequilibrium, Electron-Phonon Transport in Nanometer-Scale Silicon FETs," IEEE Transactions on Electronic Devices, Vol. 55, pp. 220-232.

103.	Gharagozloo, P.E., Eaton, J.K., and Goodson, K.E., 2008, "Diffusion, Aggregation, and the Thermal Conductivity of Nanofluids," Applied Physics Letters, Vol. 93, pp. 103110-1 - 103110-3.

102.	Reifenberg, J.P., Kencke, D.L., and Goodson, K.E., 2008, "The Impact of Thermal Boundary Resistance in Phase-Change Memory Devices," IEEE Electron Device Letters, Vol. 29, pp. 1112-1114.

101.	Panzer, M.A., Zhang, G., Mann, D., Hu, X., Pop, E., Dai, H., and Goodson, K.E., 2008, "Thermal Properties of Metal-Coated Vertically-Aligned Single-Wall Nanotube Arrays," ASME Journal of Heat Transfer, Vol. 130, pp. 052401-01 - 052401-09.

100.	Jain, A., and Goodson, K.E., 2008, "Measurement of the Thermal Conductivity and Heat Capacity of Free-Standing Shape Memory Thin Films using the 3w Method," ASME Journal of Heat Transfer, Vol. 130, pp. 102402-1 - 102402-7.

99.	Hu, X., Jain, A., and Goodson, K.E., 2008, "Investigation of the Natural Convection Boundary Condition in Microfabricated Structures," International Journal of Thermal Sciences, Vol. 47, pp. 820-824.

98.	Panzer, M.P., and Goodson, K.E., 2008, "Thermal Resistance between Low-Dimensional Nanostructures and Semi-Infinite Media," Journal of Applied Physics, Vol. 103, pp. 094301-01 - 094301-09.

2007

97.	Goodson, K.E., 2007, "Ordering up the Minimum Thermal Conductivity of Solids," Science, Vol. 315, pp. 342-343.

96.	Pop, E., Mann, D.A., Goodson, K.E., and Dai, H., 2007, "Electrical and Thermal Transport in Metallic Single-Wall Carbon Nanotubes on Insulating Substrates," Journal of Applied Physics, Vol. 101, 093710-093720.

95.	Reifenberg, J.P., Panzer, M.A., Kim, S., Gibby, A.M., Zhang, Y., Wong, S., Wong, H.S., and Goodson, K.E., 2007, "Thickness and Stoichiometry Dependence of the Thermal Conductivity of GeSbTe Films," Applied Physics Letters, Vol. 91, pp. 111904-111906.

94.	King, W.P., and Goodson, K.E., 2007, "Thermomechanical Formation of Nanoscale Polymer Indents using a Heated Silicon Tip," ASME Journal of Heat Transfer, Vol. 129, pp. 1600-1604.

93.	Hu, X., Panzer, M.A., Goodson, K.E., 2007, "Infrared Microscopy Characterization of Opposing Carbon Nanotube Arrays," ASME Journal of Heat Transfer, Vol. 129, pp. 91-93.

92.

Wang, F.-M., Steinbrenner, J. E., Hidrovo, C. H., Kramer, T. A., Lee, E. S., Vigneron, S., Cheng, C.-H., Eaton, J. K. and Goodson, K. E., 2007, "Investigation of Two-Phase Transport Phenomena in Microchannels Using a Microfabricated Experimental Structure," Applied Thermal Engineering, Vol. 27, pp 1728-1733.

91.

Steinbrenner, J. E., Hidrovo, C. H., Wang, F.- M., Lee, E. S., Vigneron, S., Kramer, T. A., Cheng, C.-H., Eaton, J. K. and Goodson, K. E., 2007, "Measurement and Modeling of Liquid Film Thickness Evolution in Stratified Two-Phase Microchannel Flows," Applied Thermal Engineering, Vol. 27, pp 1722-1727.

2006

90.	Pop, E., Sinha, S., and Goodson, K.E., 2006, "Heat Generation and Transport in Nanometer Scale Transistors," Proceedings of the IEEE, Vol. 94, pp. 1587-1601.

89.	Hu, X., Padilla, A.A., Xu, J., Fisher, T.A., and Goodson, K.E., 2006, "3 omega Measurements of the Thermal Conductivity of Vertically Oriented Carbon Nanotubes on Silicon," ASME Journal of Heat Transfer, Vol. 128, pp. 1109-1113.

88.	Sinha, S., Pop, E., Dutton R.W., and Goodson, K.E., 2006, "Non-Equilibrium Phonon Distributions in Sub-100 nm Silicon Transistors," ASME Journal of Heat Transfer, Vol. 128, pp. 638-647.

87.	Sinha, S., and Goodson, K.E., 2006, "Thermal Conduction in Sub-100nm Transistors," Microelectronics Journal, Vol. 37, pp. 1148-1157.

86.	Pop, E., Mann, D., Wang, Q., Goodson, K.E., and Dai, H., 2006, "Thermal Conductance of an Individual Single-Wall Carbon Nanotube above Room Temperature," Nano Letters, Vol. 6, pp. 96-100.

85.	Pop, E., and Goodson, K.E., 2006, "Thermal Phenomena in Nanoscale Transistors," Journal of Electronic Packaging, Vol. 128, pp. 102-108.

84.	Mann, D., Pop, E., Cao, J., Wang, Q., Goodson, K.E., and Dai, H., 2006, "Thermal and Molecular Stimulated Relaxation of Hot Phonons in Suspended Carbon Nanotubes," Journal of Physical Chemistry B, Vol. 110, pp. 1502-1505.

83.	Wang, E.N., Devasenathipathy, S., Lin, H., Hidrovo, C., Santiago, J.G., Goodson, K.E., and Kenny, T.W., 2006, "A Hybrid Method for Bubble Reconstruction in Two-Phase Microchannels," Experiments in Fluids, Vol. 40, pp. 847-858.

82.

Hidrovo, C. H., Kramer, T. A., Wang, E. N., Vigneron, S., Steinbrenner, J. E., Koo, J.-M., Wang, F.-M., Fogg, D. W., Flynn, R. D., Lee, E. S., Cheng, C.-H., Kenny, T. W., Eaton, J. K. and Goodson, K. E., 2006, "Two-Phase Microfluidics for Semiconductor Circuits and Fuel Cells," Heat Transfer Engineering, Vol. 27, pp. 53-63.

2005

81.	Im, S., Srivastava, N., Banerjee, K., and Goodson, K.E., 2005, "Scaling Analysis of Multilevel Interconnect Temperatures for High-Performance ICs," IEEE Transactions on Electron Devices, Vol. 52, pp. 2710-2719.

80.	Koo, J.M., Im, S., Jiang, L., and Goodson, K.E., 2005, "Integrated Microchannel Cooling for Three-Dimensional Circuit Architectures," ASME Journal of Heat Transfer, Vol. 127, pp. 49-58.

79.	Sinha S., and Goodson, K.E., 2005, "Review: Multiscale Thermal Modeling in Nanoelectronics," International Journal for Multiscale Computational Engineering, Vol. 3, pp. 107-133.

78.

Kenny, T.W., Goodson, K.E., Santiago, J.G., Wang, E.N., Koo, J.M., L. Jiang, Pop, E., Sinha, S., Zhang, L., Fogg, D., Yao, S., Flynn, R., Cheng, C.H., and Hidrovo, C.H., 2005, "Advanced Cooling Technologies for Microprocessors," International Journal of High Speed Electronics and Systems, Vol. 16, pp 107-133.

77.	Pop, E., Mann, D., Cao, J., Wang, Q., Goodson, K.E., and Dai, H., 2005, "Negative Differential Conductance and Hot Phonons in Suspended Nanotube Molecular Wires," Physical Review Letters, Vol. 95, pp. 155505-155509.

76.	McConnell, A.D., and Goodson, K.E., 2005, "Thermal Conduction in Silicon Micro and Nanostructures," Annual Review of Heat Transfer, Vol. 14, pp. 129-168.

75.	Sinha, S., Shelling, P.K., Phillpot, S.R., Goodson, K.E., 2005, "Scattering of g-Process Longitudinal Phonons at Hotspots in Silicon," Journal of Applied Physics, Vol. 97, no.2, pp. 023702-1-023702-9.

74.	Jain, A., Ness, K.D., Mehenti, N.Z., Fishman, H.A., and Goodson, K.E., 2005, "A microheater device for study of temperature gradient effects on neurite outgrowth in retinal ganglion cells," Investigative Opthalmology and Visual Science, Vol. 45, p. U401.

73.	Shelling, P., Li, S., and Goodson, K.E., 2005, "Managing Heat for Electronics," Materials Today, June, pp. 30-35.

72.	Zhang, L., Wang, E.N., Goodson, K.E., and Kenny, T.W., 2005, "Phase Change Phenomena in Silicon Microchannels," International Journal of Heat and Mass Transfer, Vol. 48, no.8, pp.1572-1582.

71.	Pop, E., Dutton, R.W., and Goodson, K.E., 2005, "Monte Carlo simulation of Joule Heating in Bulk and Strained Silicon," Applied Physics Letters, Vol. 86, pp. 082101-082103.

2004

70.	Pop, E., Dutton, B., and Goodson, K.E., 2004, "Analytic Band Monte Carlo Model for Electron Transport Modeling in Si Including Acoustic and Optical Phonon Dispersion," Journal of Applied Physics, Vol. 96, no. 9, pp. 4998-5005.

69.	Wang, E.N., Zhang, L., Jiang, L., Koo, J.M., Maveety, J., Sanchez, E., Goodson, K.E., and Kenny, T.W., 2004, "Micromachined Jets for Liquid Impingement Cooling of VLSI Chips," Journal of MicroElectroMechanical Systems, Vol. 13, pp. 833-842.

68.	Wang, E.N., Devasenathipathy, S., Santiago, J.G., Goodson, K.E., and Kenny. T.W., 2004, "Nucleation and Growth of Vapor Bubbles in a Heated Silicon Microchannel," ASME Journal of Heat Transfer, Vol. 128, p. 497.

67.	Wheeler, E.K., Benett, W., Stratton, P., Richards, J., Chen, A., Christian, A., Ness, K.D., Ortega, J., Li, L.G., Weisgraber, T.H., Goodson, K., Milanovich, F., 2004, "Convectively Driven Polymerase Chain Reaction Thermal Cycler," Analytical Chemistry, Vol.76, no.14, pp. 4011-4016.

66.	King, W.P., Kenny, T.W., and Goodson, K.E., 2004, "Comparison of Thermal and Piezoresistive Sensing Approaches for Atomic Force Microscopy Topography Measurements," Applied Physics Letters, Vol. 85, pp. 2086-2088.

2003

65.	Chu, D., Wong, W.K., Goodson, K.E., and Pease, R.F.W., 2003, "Transient Temperature Measurements of Resist Heating using Nano Thermocouples," Journal of Vacuum Science and Technology B, Vol. 21, pp. 2985-2989.

64.	Fletcher, D.A., Kino, D.S., and Goodson, K.E., 2003, "Thermal Microscopy with a Microfabricated Solid Immersion Lens," Microscale Thermophysical Engineering, Vol. 7, pp. 267-273.

63.	Cahill, D.G., Ford, W.K., Goodson, K.E., Mahan, G.D., Majumdar, A., Maris, H.J., Merlin, R., and Phillpot, S.R., 2003, "Nanoscale Thermal Transport," Journal of Applied Physics, Vol. 93, 793-818.

2002

62.	Chu, D., Bilir, D.T., Pease, R.F.W., and Goodson, K.E., 2002, "Submicron Thermocouple Measurements of Electron-Beam Resist Heating," Journal of Applied Physics, Vol. 20, pp. 3044-3046.

61.

King, W.P., Kenny, T.W., Goodson, K.E., Cross, G.L.W., Despont, M., Durig, U.T., Rothuizen, H., Binnig, G.K., and Vettiger, P., 2002, "Design of Atomic Force Microscope Cantilevers for Combined Thermomechanical Writing and Thermal Reading in Array Operation," Journal of MicroElectroMechanical Systems, pp. 765-774.

60.	Goodson, K.E., Santiago, J.G., Kenny, T., Jiang, L., Zeng, S., Koo, J.M., Zhang, L., Yao, S., and Wang, E., 2002, "Electroosmotic Microchannel Cooling System for Microprocessors," Electronics Cooling, Vol. 8, pp. 46-47.

59.	Zhang L., Koo, J.M., Jiang L., Goodson K.E., Santiago J.G., Kenny T.W., "Measurements and Modeling of Two-Phase Flow in Microchannels with Nearly-Constant Heat Flux Boundary Conditions," 2002, IEEE/ASME Journal of MicroElectroMechanical Engineering, Vol. 11, pp. 12-19.

58.

Jiang, L., Mikkelsen, J., Koo, J.-M., Huber, D., Yao, S., Zhang, L., Zhou, P., Maveety, J., Prasher, R., Santiago, J.G., Kenny, T.W. Goodson, K.E., 2002, "Closed-Loop Electroosmotic Cooling System for VLSI Circuits," IEEE Proceedings on Components, Packaging, and Manufacturing Technology, Vol. 25, No. 3, pp. 347-355.

57.	Cahill, D., Goodson, K.E., and Majumdar, A., 2002, "Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures," ASME Journal of Heat Transfer, Vol. 124, No. 2, pp. 223-240.

56.	King, W.P., and Goodson, K.E., 2002, "Thermal Writing and Nanoimaging with a Heated Atomic Force Microscope Cantilever," ASME Journal of Heat Transfer, Vol. 124, p. 597.

55.	Asheghi, M., Kurabayashi, K., Kasnavi, K., and Goodson, K.E., 2002, "Thermal conduction in doped single-crystal silicon films," Journal of Applied Physics, Vol. 91, pp 5079-5088.

2001

54.	Chu, D.C., Touzelbaev, M., Goodson, K.E., Babin, S., and Pease, R.F., 2001, "Thermal Conductivity Measurements of Thin-Film Resist," Journal of Vacuum Science & Technology B, Vol. 19, pp. 2874-2877.

53.	McConnell, A.D., Srinivasan, U, Asheghi, M., and Goodson, K.E., 2001, "Thermal Conductivity of Doped Polysilicon," IEEE/ASME Journal of MicroElectroMechanical Systems, Vol. 10, pp. 360-369.

52.	Zhou, P., and Goodson, K.E., 2001, "Subpixel Displacement and Deformation Gradient Measurement using Digital Image/Speckle Correlation (DISC)," Optical Engineering, Vol. 40, pp. 1613-1620.

51.	Fletcher, D.A., Crozier, K.B., Quate, C.F., Kino, G.S., Goodson, K.E., Simanovskii, D., Palanker, D.V., 2001, "Refraction Contrast Imaging with a Scanning Microlens," Applied Physics Letters, Vol. 78, pp. 3589-3591.

50.	Fletcher, D.A., Crozier, K.B., Guarini, K.W., Minne, S.C., Kino, G.S., Quate, C.F., and Goodson, K.E., 2001, "Microfabricated Silicon Solid Immersion Lens," IEEE/ASME Journal of MicroElectroMechanical Engineering, Vol. 10, pp. 450-459.

49.	Fletcher, D.A., Goodson, K.E., and Kino, G.S., 2001, "Focussing in Microlenses Close to a Wavelength in Diameter," Optics Letters, Vol. 26, pp. 399-401.

48.	Touzelbaev, M.N., Zhou, P., Venkatasubramanian, R., Goodson, K.E., 2001, "Thermal Characterization of Bi2Te3/Sb2Te3 Superlattices," Journal of Applied Physics, Vol. 90, pp. 763-767.

47.	Sverdrup, P.G., Sinha, S., Uma, S., Asheghi, M., and Goodson, K.E., 2001, "Measurement of Ballistic Phonon Conduction Near Hotspots in Silicon," Applied Physics Letters, Vol. 78, pp. 3331-3333.

46.	King, W.P., Kenny, T.W., Goodson, K.E., Cross, G., Despont, M., Durig, U., Rothuizen, H., Binnig, G.K., and Vettiger, P., 2001, "Atomic Force Microscope Cantilevers for Combined Thermomechanical Data Writing and Reading," Applied Physics Letters, Vol. 78, pp. 1300-1302.

45.	Uma, S., McConnell, A.D., Asheghi, M., Kurabayashi, K., and Goodson, K.E., 2001, "Temperature Dependent Thermal Conductivity of Undoped Polycrystalline Silicon Layers," International Journal of Thermophysics, Vol. 22, pp. 605-616.

44.	Touzelbaev, M.N., and Goodson, K.E, 2001, "Impact of Experimental Timescale and Geometry on Thin-Film Thermal Property Measurements," International Journal of Thermophysics, Vol. 22, pp. 243-263.

43.	Sverdrup, P.G., Ju, Y.S., and Goodson, K.E., 2001, "Sub-Continuum Simulations of Heat Conduction in Silicon-on-Insulator Transistors," ASME Journal of Heat Transfer, Vol. 123, pp. 30-37.

2000

42.	Fletcher, D.A., Crozier, K.B., Quate, C.F., Kino, K.S., Goodson, K.E., Simanovskii, D., and Palanker, D.V., 2000, "Near-field infrared imaging with a microfabricated solid immersion lens," Applied Physics Letters, Vol. 77, pp. 2109-2111.

41.	Durig, U., Cross, G., Despont, M., Drechsler, U., Haeberle, W., Lutwyche, M.I., Rothuizen, H., Stutz, R., Widmer, R., Vettiger, P., Binnig, G.K., King, W.P., and Goodson, K.E., 2000, "Millipede - An AFM Data Storage System at the Frontier of Nanotribology," Tribology Letters, Vol. 9, pp. 25-32.

1999

40.	Kurabayashi, K., and Goodson, K.E., 1999, "Impact of Molecular Orientation on Thermal Conduction in Spin-Coated Polyimide Films," Journal of Applied Physics, Vol. 86, pp. 1925-1931.

39.	Goodson, K.E., and Ju, Y.S., 1999, "Heat Conduction in Novel Electronic Films," in the Annual Review of Materials Science, E.N. Kaufmann et al., eds., Annual Reviews, Palo Alto, CA, Vol. 29, pp. 261-293.

38.	Ju, Y.S., and Goodson, K.E., 1999, "Phonon Scattering in Silicon Films of Thickness Below 100 nm," Applied Physics Letters, Vol. 74, pp. 3005-3007.

37.	Kurabayashi, K., Asheghi, M., Touzelbaev, M.N., and Goodson, K.E., 1999, "Measurement of the Thermal Conductivity Anisotropy in Polyimide Films," IEEE/ASME Journal of MicroElectroMechanical Systems, Vol. 8, pp. 180-191.

36.	Chui, B.W., Asheghi, M., Ju, Y.S., Goodson, K.E., Kenny, T.W., and Mamin, H.J., 1999, "Intrinsic-Carrier Thermal Runaway in Silicon Microcantilevers," Microscale Thermophysical Engineering, Vol. 3, pp. 217-224.

35.	Ju, Y.S., and Goodson, K.E., 1999, "Process-Dependent Thermal Transport Properties of Silicon Dioxide Films Deposited using Low-Pressure Chemical Vapor Deposited," Journal of Applied Physics, Vol. 85, pp. 7130-7134.

34.	Ju, Y.S., Kurabayashi, K., and Goodson K.E., 1999, "Thermal Characterization of Anisotropic Thin Dielectric Films using Harmonic Joule Heating," Thin Solid Films, Vol. 339, pp. 160-164.

1998

33.	Asheghi, M., Touzelbaev, M.N., Goodson, K.E., Leung, Y.K., and Wong, S.S., 1998, "Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates," ASME Journal of Heat Transfer, Vol. 120, pp. 31-36.

32.	Touzelbaev, M.N., and Goodson, K.E., 1998, "Applications of Micron-Scale Passive Diamond Layers for the IC and MEMS Industries," Diamond and Related Materials, Vol. 7, pp. 1 - 14.

31.	Ju, Y.S., and Goodson, K.E., 1998, "Short-Time-Scale Thermal Mapping of Microdevices using a Scanning Thermoreflectance Technique," ASME Journal of Heat Transfer, Vol. 120, pp. 306-313.

30.	Kurabayashi, K., and Goodson, K.E., 1998, "Precision Measurement and Mapping of Die-Attach Thermal Resistance," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. A21, pp. 506-514.

29.

Cahill, D., Chen, G., Dresselhaus, M.S., Goodson, K.E., Ho, C.M., Longtin, J., Majumdar, A., Phinney, L., Pohl, R., Tien, C.L., Wong, C., 1998, "Report of Workshop: 2nd Microthermal Workshop and Tutorial at the Albuquerque Convention Center," Microscale Thermophysical Engineering, Vol. 2, pp. 215-244.

28.	Ju, Y.S., Kurabayashi, K., and Goodson, K.E., 1998, "Thermal Characterization of IC Interconnect Passivation using Joule Heating and Optical Thermometry," Microscale Thermophysical Engineering, Vol. 2, pp. 101-110.

27.	Chaudhari, A., Woudenberg, T., Albin, M., and Goodson, K.E., 1998, "Transient Liquid-Crystal Thermometry of Microfabricated PCR Vessel Arrays," IEEE/ASME Journal of MicroElectroMechanical Systems, Vol. 7, pp. 345-355.

26.

Chui, B.W., Stowe, T.D., Ju, Y.S., Goodson, K.E., Kenny, T.W., Mamin, H.J., Terris, B.D., Ried, R.P., and Rugar, D., 1998, "Low-Stiffness Silicon Cantilevers with Integrated Heaters and Piezoresistive Sensors for High-Density AFM Thermomechanical Data Storage," IEEE/ASME Journal of MicroElectroMechnical Systems, Vol. 7, pp. 69-78.

1997

25.	Touzelbaev, M.N., and Goodson K.E., 1997, "Impact of Nucleation Density on Thermal Resistance Near Diamond-Substrate Boundaries," AIAA Journal of Thermophysics and Heat Transfer, Vol. 11, pp. 506-512.

24.	Ju, Y.S., and Goodson, K.E., 1997, "Thermal Mapping of Interconnects Subjected to Brief Electrical Stresses," IEEE Electron Device Letters, Vol. 18, pp. 512-514.

23.	Asheghi, M., Leung, Y.K., Wong, S.S., and Goodson, K.E., 1997, "Phonon-Boundary Scattering in Thin Silicon Layers," Applied Physics Letters, Vol. 71, pp. 1798-1800.

22.	Ju, Y.S., Kading, O.W., Leung, Y.K., Wong, S.S., and Goodson, K. E., 1997, "Short-Timescale Thermal Mapping of Semiconductor Devices," IEEE Electron Device Letters, Vol. 18, pp. 169-171.

21.	Leung, Y.-K., Paul, A.K., Goodson, K.E., Plummer, J.D., and Wong, S.S., 1997, "Heating Mechanisms of LDMOS and LIGBT in Ultrathin SOI," IEEE Electron Device Letters, Vol. 18, pp. 414-416.

20.	Goodson, K.E., and Asheghi, M., 1997, "Near-Field Optical Thermometry," Microscale Thermophysical Engineering, Vol. 1, pp. 225-235.

19.	Ju, Y.S., and Goodson, K.E., 1997, "Size Effect on the Thermal Conductivity of Silicon-on-Insulator Devices under Electrostatic Discharge (ESD) Conditions," Japanese Journal of Applied Physics, Part 2, Letters, Vol. 36, pp. L798-L800.

18.	Goodson, K.E., Kurabayashi, K., and Pease, R.F.W., 1997, "Improved Heat Sinking for Laser-Diode Arrays using Microchannels in CVD Diamond," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. B20, pp. 104-109.

17.	Chen, G., Goodson, K.E., Grigoropoulos, C., Hipwell, M.C., Liepmann, D., Majumdar, A., Maruyama, S., Thundat, T., Tien, C.L., Tien, N.C., 1997, "Report of Workshop: Thermophysical Phenomena in Microscale Sensors, Devices, and Structures," Microscale Thermophysical Engineering, Vol. 1, pp. 267-274.

1996

16.	Goodson, K.E., 1996, "Thermal Conduction in Nonhomogeneous CVD Diamond Layers in Electronic Microstructures," ASME Journal of Heat Transfer, Vol. 118, pp. 279-286.

1995

15.	Goodson, K.E., Kading, O.W., Rosler, M. and Zachai, R., 1995, "Thermal Conduction normal to Diamond-Silicon Boundaries," Applied Physics Letters, Vol. 66, pp. 3134-3136.

14.	Goodson, K.E., Kading, O.W., Rosler, M. and Zachai, R., 1995, "Experimental Investigation of Thermal Conduction normal to Diamond-Silicon Boundaries," Journal of Applied Physics, Vol. 77, pp. 1385-1392.

13.	Goodson, K.E., Flik, M.I., Su, L.T., and Antoniadis, D.A., 1995, "Prediction and Measurement of Temperature Fields in Silicon-on-Insulator Electronic Circuits," ASME Journal of Heat Transfer, Vol. 117, pp. 574-581.

1994

12.	Kading, O.W., Skurk, H., and Goodson, K.E., 1994, "Thermal Conduction in Metallized Silicon-Dioxide Layers on Silicon," Applied Physics Letters, Vol. 65, pp. 1629-1631.

11.	Su, L.T., Chung, J.E., Antoniadis, D.A., Goodson, K.E., and Flik, M.I., 1994, "Measurement and Modeling of Self-Heating in SOI nMOSFETS," IEEE Transactions on Electron Devices, Vol. 41, pp. 69-75.

10.	Goodson, K.E., and Flik, M.I., 1994, "Thermal Conduction Processes with Sub-Micrometer Lengthscales in Electronic Circuits," Thermal Science and Engineering, Vol. 2, pp. 191-201.

9.	Goodson, K.E., and Flik, M.I., 1994, "Solid-Layer Thermal-Conductivity Measurement Techniques," Applied Mechanics Reviews, Vol. 47, pp. 101-112.

8.	Goodson, K.E., Flik, M.I., Su, L.T., and Antoniadis, D.A., 1994, "Prediction and Measurement of the Thermal Conductivity of Amorphous Dielectric Layers," ASME Journal of Heat Transfer, Vol. 116, pp. 317-324.

1993

7.	Goodson, K.E., Flik, M.I., Su, L.T., and Antoniadis, D.A., 1993, "Annealing-Temperature Dependence of the Thermal Conductivity of LPCVD Silicon-Dioxide Layers," IEEE Electron Device Letters, Vol. 14, pp. 490-492.

6.	Goodson, K.E., and Flik, M.I., 1993, "Electron and Phonon Thermal Conduction in Epitaxial High-Tc Superconducting Films," ASME Journal of Heat Transfer, Vol. 115, pp. 17-25.

5.	Flik, M.I., Zhang, Z.Z., and Goodson, K.E., 1993, "Intrinsic Superconducting Radiation Detector," Applied Physics Letters, Vol. 62, pp. 2862-2864.

1992

4.	Goodson, K.E., and Flik, M.I., 1992, "Effect of Microscale Thermal Conduction on the Packing Limit of Silicon-on-Insulator Electronic Devices," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 15, pp. 715-722.

3.	Flik, M.I., Zhang, Z.M., Goodson, K.E., Siegal, M.P., and Phillips, J.M., 1992, "The Electron Scattering Rate in Epitaxial YBa2Cu3O7 Superconducting Films," Physical Review B, Vol. 46, pp. 5606-5614.

2.	Flik, M.I., Choi, B.I., and Goodson, K.E., 1992, "Heat Transfer Regimes in Microstructures," ASME Journal of Heat Transfer, Vol. 114, pp. 666-674.

1.	Flik, M.I., and Goodson, K.E., 1992, "Thermal Analysis of Electron-Beam Absorption in Low-Temperature Superconducting Films," ASME Journal of Heat Transfer, Vol. 114, pp. 264-270.

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