|
|
GOODSON GROUP PUBLICATIONS
2. Books and Book Chapters
(Current Group Members and Group Alumni in Bold)
Links and PDFs are provided below only within fair use. We assume you have proper copyright permissions to access and they are supplied as a convenience only.
 |
| 10. | Hidrovo, C., Goodson, K.E., 2008, "Active Microfluidic Cooling of Integrated Circuits," in Electrical, Optical, and Thermal Interconnections for 3D Integrated Systems, J. Meindl and M. Bakir, eds., Artech, Boston, pp. 293-330. |
|
| |
| 9. | McConnell, A.D., and Goodson, K.E., 2005, "Thermal Conduction in Silicon Micro and Nanostructures," in the Annual Review of Heat Transfer, Vol. 14, pp. 129-168. |
|
|
| 8. | L. Zhang, Goodson, K.E., and Kenny, T.W., 2003, Book: "Silicon Microchannel Heat
Sinks: Theories and Phenomena," Springer-Verlag Microtechnology and MEMS
Series, ISBN 3-540-40181-4. |
|
| |
| 7. | King, W.P., and Goodson, K.E., 2002, "Thermomechanical Formation and Thermal Imaging of Polymer Nanostructures" in Heat Transfer and Fluid Flow in Microscale and Nanoscale Devices, M. Faghri and B. Sunden, Eds., Southampton: WIT Press, pp. 131-171. |
|
|
| 6. | Goodson, K.E., 2000, "Thermal Conduction in Electronic Microstructures," in the Thermal Engineering Handbook, F. Kreith, ed., CRC Press, Boca Raton, Florida, pp. 4.458 - 4.504. |
|
| |
| 5. |
Goodson, K.E., and Ju, Y.S., 1999, "Heat Conduction in Novel Electronic Films," in the Annual Review of Materials Science, E.N. Kaufmann et al., eds., Annual Reviews, Palo Alto, CA, Vol. 29, pp. 261-293. |
|
|
| 4. |
Ju, Y.S., and Goodson, 1999, Book: "Microscale Heat Conduction in Integrated Circuits and their Constituent Films," Kluwer Academic Publishers, Boston. |
|
|
| 3. |
Goodson, K.E., Ju, Y.S., and Asheghi, M., 1998, "Thermal Phenomena in Semiconductor Devices and Interconnects," in Microscale Energy Transport, C.L. Tien et al., eds., Taylor & Francis, New York, NY, pp. 229-293. |
|
|
| 2. |
Goodson, K.E., 1995, "Impact of CVD Diamond Layers on the Thermal Engineering of Electronic Systems," in the Annual Review of Heat Transfer, C.L. Tien, ed., Begell House, New York, NY, Vol. 6, pp. 323-353 |
|
|
| 1. |
Goodson, K.E., and Flik, M.I., 1994, "Solid-Layer Thermal-Conductivity Measurement Techniques," Applied Mechanics Reviews, Vol. 47, pp. 101-112. |
|
|
