BOOK
R. T. Howe and C. G. Sodini, Microelectronics: an Integrated Approach, Prentice Hall, 1997.
REFEREED PUBLICATIONS
Archival Journal Papers
1. C.
S. Roper, V. Radmilovic, R. T. Howe, and R. Maboudian, ÒCharacterization of
polycrystalline 3C-SiC films deposited from precursors of 1,3-disilabutane and
dichlorosilane,Ó Journal of Applied
Physics, 103, 084907 (2008).
2. G.
K. Fedder, R. T. Howe, T.-J. King Liu, and E. P. QuŽvy, ÒTechnologies for
Co-Fabricating MEMS and Electronics,Ó Proceedings
of the IEEE, 96, 306-322 (2008).
3. C.
S. Roper, V. Radmilovic, R. T. Howe, and R. Maboudian, ÒEffects of annealing on
residual stress and strain gradient of doped polycrystalline SiC thin films,Ó Electrochem. Solid-State Letters, 11, D35 – D37 (2008).
4. K.
Arkarvardar, C. Eggimann, D. Tsamados, Y. S. Chauhan, G. C. Wan, A, M. Ionescu,
R. T. Howe, and H.-S. P. Wong, ÒAnalytical modeling of the suspended-gate FET
and design insights for low-power logic, IEEE
Transactions on Electron Devices, 55,
48-59 (2008).
5. J. Zhang, J. W. Zimmer, R. T. Howe, and R. Maboudian,
ÒCharacterization of boron-doped micro- and nanocrystalline diamond films
deposited by wafer-scale hot filament chemical vapor deposition for MEMS
applications,Ó Diamond and Related
Materials, 17, 23-28 (2008).
6. J. Zhang, C. Carraro, R. T. Howe, and R. Maboudian,
ÒElectrical, mechanical and metal contact properties of polycrystalline 3C-SiC
films for MEMS in harsh environments,Ó Surface
& Coatings Tech., 201,
8893-8898 (2007).
7. J. Zhang, R. T. Howe, and R. Maboudian, ÒNickel and
platinum ohmic contacts to polycrystalline 3C-silicon carbide,Ó Materials Science & Enginering B, 139, 235-239 (2007).
8. A. San Paulo, N. Arellano, J. A. Plaza, R. He, C.
Carraro, R. Maboudian, R. T. Howe, J. Bokor, and P. Yang, ÒSuspended mechanical
structures based on elastic silicon nanowire arrays,Ó Nano Letters, 7,
1100-1104 (2007).
9. A. San Paulo, E. Quevy, J. Black, R. T. Howe, R.
White, and J. Bokor, ÒMode shape imaging of out-of-plane and in-plane vibrating
RF micromechanical resonators by atomic force microscopy,Ó Microelectronic Engineering, 84,
1354-1357 (2007).
10. C. W. Low, T.-J. King Liu, and R. T. Howe,
ÒCharacterization of polycrystalline silicon-germanium film deposition for
modularly integrated MEMS applications, IEEE/ASME
J. Microelectromechanical Systems, 16,
68-77 (2007).
11. C.
S. Roper, R. T. Howe, and R. Maboudian, ÒStress control of polycrystalline
3C-SiC films in a large-scale LPCVD reactor using 1,3-disilabutane and
dichlorosilane as precursors,Ó J.
Micromechanics and Microengineering, 16,
2736-2739 (2006).
12. C.
S. Roper, V. Radmilovic, R. T. Howe, and R. Maboudian, ÒSingle-source chemical
vapor deposition of SiC films in a large-scale low-pressure mechanical
characterization reactor,Ó J.
Electrochem. Soc., 153, C562-566
(2006).
13. J.
C. Zhang, R. T. Howe, and R. Maboudian, ÒControl of strain gradient in doped
polycrystalline silicon carbide films through tailored doping,Ó J. Micromechanics and Microengineering, 16, L1-L5 (2006).
14. J.
C. Zhang, R. T. Howe, and R. Maboudian, ÒElectrical characterization of n-type
polycrystalline 3C-silicon carbide thin films deposited by 1,3-disilabutane, J. Electrochem. Soc., 153, G548-G551 (2006).
15. D.
Gao, C. Carraro, R. T. Howe, and R. Maboudian, ÒPolycrystalline silicon carbide
as a substrate material for reducing adhesion in MEMS,Ó Tribology Lett., 21,
226-232 (2006).
16. A.
S. Phani, A. A. Seshia, M. Palaniapan, R. T. Howe, and J. Yasaitis, ÒModal
coupling in micromechanical vibratory rate gyroscopes,Ó IEEE Sensors Journal, 6,
1144-52 (2006).
17. A. San Paulo, J. Bokor, R. T. Howe, R. He, P. Yang, D.
Gao, C. Carraro, and R. Maboudian, ÒMechanical elasticity of single and double
clamped silicon nanobeams fabricated by the vapor-liquid-solid method,Ó Applied Physics Letters, 87, 53111-13, (2005).
18. D. Gao, R. He, C. Carraro, R. T. Howe, P. Yang, and R.
Maboudian, ÒSelective growth of Si nanowire arrays via galvanic displacement
processes in water-in-oil microemulsions,Ó Journal
of the Americal Chemical Society, 127,
4574-4575 (2005).
19. H.
Takeuchi, A. Wun, Xin Sun, R. T. Howe, and T.-J. King, ÒThermal budget limits
of quarter-micrometer foundry CMOS for post-processing MEMS devices,Ó IEEE Trans. Electron Devices, 52, 2081-2086, (2005).
20. S.
Sedky, J. Schroeder, T.-J. King, and R. T. Howe, ÒEffect of eximer laser
annealing on the structural propoerties of silicon germanium films,Ó J. Materials Research, 19, 3503-3511 (2004).
21. H.
Takeuchi, E. Quevy, S. Bhave, T.-J. King, and R. T. Howe, ÒGe-blade damascene
process for post-CMOS integration of nano-mechanical resonators,Ó IEEE Electron Device Lett., 25, 529-531, (2004).
22. D. Gao, C. Carraro, V. Radmilovic, R. T. Howe, and R. Maboudian, ÒFracture of polycrystalline 3C-SiC films in microelectromechanical systems,Ó IEEE/ASME J. of Microelectromechanical Systems, 13, 972-976 (2004).
23. S. Sedky, R. T. Howe, and T.-J. King, ÒPulsed Laser Annealing, a Low Thermal Budget Technique for Eliminating Stress Gradient in Poly-SiGe MEMS Structures,Ó IEEE/ASME J. of Microelectromechanical Systems, 13, 669-675 (2004).
24. D. Gao, R. T. Howe, and R. Mabouidan, ÒTransformer coupled plasma etching of 3C-SiC films using fluorinated chemistry for MEMS applications,Ó J. Vac. Sci. Tech. B, 22, 513-518 (2004).
25. D. Gao, M. B. J. Wijesundara, C. Carraro, R. T. Howe, and R. Maboudian, ÒRecent progress toward a manufacturable polycrystalline SiC surface micromachining technology,Ó IEEE Sensors Journal, 4, 441-448 (2004).
26. K. L. Scott, T. Hirano, H. Yang, H. Singh, R. T. Howe, and A. M. Niknejad, ÒHigh performance inductors using capillary based fluidic self-assembly,Ó IEEE/ASME J. of Microelectromechanical Systems, 13, 300-309 (2004).
27. C. L. Muhlstein, R. T. Howe, and R. O. Ritchie, ÒFatigue of Polycrystalline Silicon for Microelectromechanical Systems: Crack Growth and Stability under Resonant Loading Conditions,Ó Mechanics of Materials, 36, 13-33 (2004).
28. M. B. J. Wijesundara, G. Valente, R. T. Howe, A. P. Pisano, C. Carraro, and R. Maboudian, ÒSingle-source chemical vapor deposition of 3C-SiC films in a LPCVD reactor, part I: Growth, Structure, and Chemical Characterization,Ó Journal of the Electrochemical Society, 151, 210-214 (2004).
29. M. M. Maharbiz, W. J. Holtz, R. T. Howe, and J. D. Keasling, ÒMicrobioreactor arrays with parametric control for high-throughput experimentation,Ó Biotechnology and Bioengineering, 85, 376-381 (2004).
30. M. B. J. Wijesundara, D. Gao, C. Carraro, R. T. Howe, and R. Maboudian, ÒNitrogen doping of polycrystalline 3C-SiC films using 1,3-disilabutane in a conventional LPCVD reactor,Ó J. Crystal Growth, 259, 18-25 (2003).
31. D. Gao, M. B. J. Wijesundara, C. Carraro, R. T. Howe, and R. Maboudian, ÒCharacterization of residual strain in SiC films deposited using 1,3-disilabutane for MEMS applications,Ó J. Microlith., Microfab., Microsyst., 2, 259-264 (2003).
32. P. S. Riehl, K. L. Scott, R. S. Muller, R. T. Howe, and J. A. Yasaitis, ÒElectrostatic charge and field sensors based on micromechanical resonators,Ó IEEE/ASME J. of Microelectromechanical Systems, 12, 577-589 (2003).
33. M. M. Maharbiz, W. J. Holtz, S. Sharifzadeh, J. D. Keasling, and R. T. Howe, ÒA microfabricated electrochemical oxygen generator for high-density cell culture arrays,Ó IEEE/ASME J. of Microelectromechanical Systems, 12, 590-599 (2003).
34. D. Gao, R. T. Howe, and R. Maboudian, ÒHigh-selectivity etching of polycrystalline 3C-SiC films using HBr-based transformer coupled plasma,Ó Applied Physics Letters, 82, 1742-1744 (2003).
35. Y.-C. Jeon, T.-J. King, and R. T. Howe, ÒProperties of phosphorus-doped poly-SiGe films for MEMS applications,Ó Journal of the Electrochemical Society, 150, H1-H6 (2003).
36. A. E. Franke, J. M. Heck, T.-J. King, and R. T. Howe, ÒPolycrystalline silicon germanium films for integrated microsystems,Ó IEEE/ASME Journal of Micro-electromechanical Systems, 12, 160-171 (2003).
37. M. B. J. Wijesundara, C. R. Stoldt, C. Carraro, R. T. Howe, and R. Maboudian, ÒNitrogen doping of 3C-SiC films grown by single-source chemical vapor deposition,Ó Thin Solid Films, 419, 69-75 (2002).
38. A. A. Seshia, M. Palaniapan, T. A. Roessig, R.T. Howe, R.W. Gooch, T. R. Schimert, and S. Montague, ÒA vacuum packaged surface micromachined resonant accelerometer,Ó IEEE/ASME Journal of Microelectromechanical Systems, 11, 784-793 (2002).
39. C. R. Stoldt, C. Carraro, W. R. Ashurst, D. Gao, R. T. Howe, and R. Maboudian, ÒA low-temperature CVD process for silicon carbide MEMS,Ó Sensors and Actuators A, 97-98, 410-415 (2002).
40. U. Srinivasan, M. A. Helmbrecht, C. Rembe, R. S. Muller, and R. T. Howe, ÒFluidic self-assembly of micromirrors onto microactuators using capillary forces (invited), IEEE Journal on Selected Topics in Quantum Electronics, 8, 4-11 (2002).
41. L. Muller, A. P. Pisano, and R. T. Howe, ÒMicrogimbal torsion beam design using open, thin-walled cross sections,Ó IEEE/ASME J. of Microelectromechanical Systems, 10, 550-560 (2001).
42. W. R. Ashurst, C. Yau, C. Carraro, C. Lee, G. J. Kluth, R. T. Howe, and R. Maboudian, ÒAlkene based monolayer films as anti-stiction coatings for polysilicon MEMS,Ó Sensors and Actuators A, 91, 239-248 (2001).
43. L. Muller, R. T. Howe, and A. P. Pisano, ÒHigh-aspect-ratio, molded microstructures with electrical isolation and embedded interconnects,Ó Microsystem Technologies, 7, 47-54, (2001).
44. U. Srinivasan, D. Liepmann, and R. T. Howe, ÒMicrostructure to substrate self-assembly using capillary forces,Ó IEEE/ASME J. of Microelectromechanical Systems, 10, 17-24 (2001).
45. C. T.-C. Nguyen and R. T. Howe, ÒAn integrated CMOS micromechanical resonator high-Q oscillator,Ó IEEE J. Solid-State Circuits, 34, 440-455 (1999).
46. L. Lin, R. T. Howe, and A. P. Pisano, ÒMicroelectromechanical filters for signal processing,Ó IEEE/ASME J. of Microelectromechanical Systems, 7, 286-294 (1998).
47. J. M. Bustillo, R. T. Howe, and R. S. Muller, ÒSurface micromachining for micro-electro-mechanical systems,Ó (invited), Proc. of the IEEE, 86, 1552-1574 (1998).
48. U. Srinivasan, M. R. Houston, R. T. Howe, and R. Maboudian, ÒAlkyltrichlorosilane-based self-assembled monolayer films for stiction reduction,Ó IEEE/ASME J. of Micro-electromechanical Systems, 7, 252-260 (1998).
49. L. Lin, A. P. Pisano, and R. T. Howe, ÒA micro strain gauge with mechanical amplifier,Ó IEEE/ASME J. of Microelectromechanical Systems, 6, 313-321 (1997).
50. R. Maboudian and R. T. Howe, ÒStiction reduction processes for surface micromachines,Ó Tribology Letters, 3, 215-221 (1997).
51. R. Maboudian and R. T. Howe, ÒCritical review: stiction in surface micromechanical structures,Ó (invited), J. Vacuum Science and Technology B, B15, 1-19, (1997).
52. M. R. Houston, R. T. Howe, and R. Maboudian, ÒEffect of hydrogen termination on the work of adhesion between rough polycrystalline silicon surfaces,Ó J. of Applied Physics, 81, 3474-3483 (1997).
53. G. K. Fedder and R. T. Howe, ÒMulti-mode digital control of suspended polysilicon microstructures,Ó IEEE/ASME J. of Microelectromechanical Systems, 5, 283-297 (1996).
54. R. T. Howe, B. E. Boser, and A. P. Pisano, ÒPolysilicon integrated microsystems: technologies and applications,Ó (invited) Sensors and Actuators A, 56, 167-177 (1996).
55. B. E. Boser and R. T. Howe, ÒSurface micromachined accelerometers,Ó IEEE J. of Solid-State Circuits, 31, 366-375, (1996).
56. P. Cheung, R. Horowitz, and R. T. Howe, ÒDesign, fabrication, position sensing, and control of an electrostatically driven polysilicon microactuator,Ó IEEE Trans. on Magnetics, 32, 122-128 (1996).
57. J. M. Bustillo, G. K. Fedder, C. T.-C. Nguyen, and R. T. Howe, ÒProcess Technology for the Modular Integration of CMOS and Microstructures,Ó (invited) Microsystem Technology, 1, 30-41 (1994).
58. R. L. Alley, K. Komvopoulos, and R. T. Howe, ÒSelf-assembled monolayer film for enhanced imaging of rough surfaces with atomic force microscopy,Ó J. of Applied Physics, 76, 5731-5737, (1994).
59. Y.-H. Cho, B. M. Kwak, A. P. Pisano, and R. T. Howe, ÒSlide film damping in laterally driven microstructures,Ó Sensors and Actuators A, 40, 31-39 (1994).
60. D. J. Monk, D. S. Soane, and R. T. Howe, ÒSilicon dioxide sacrificial layer hydrofluoric acid etching: Part I - experimental observations,Ó J. of the Electrochemical Society, 141, 264-269 (1994).
61. D. J. Monk, D. S. Soane, and R. T. Howe, ÒSilicon dioxide sacrificial layer hydrofluoric acid etching: Part II -- modeling,Ó J. of the Electrochemical Society, 141, 271-274 (1994).
62. Y.-H. Cho, B. M. Kwak, A. P. Pisano, and R. T. Howe, ÒViscous damping model for laterally oscillating microstructures,Ó IEEE/ASME J. of Microelectromechanical Systems, 3, 81-87 (1994).
63. D. J. Monk, D. S. Soane, and R. T. Howe, ÒA Chemical Reaction Mechanism and Kinetics for Hydrofluoric Acid Etching of Silicon Dioxide Thin Films,Ó (invited review) Thin Solid Films, 232, 1, 1-12 (1993).
64. D. J. Monk, D. S. Soane, and R. T. Howe, ÒDetermination of the etching kinetics for the hydrofluoric acid/silicon dioxide system,Ó J. of the Electrochemical Society, 140, 2339-2346, (1993).
65. W. C. Tang, M. G. Lim, and R. T. Howe, "Electrostatic comb drive levitation and control method," IEEE/ASME Journal of Microelectromechanical Systems, 1, 4, 170-178 (1992).
66. R. M. Moroney, R. M. White, and R. T. Howe, ÒMicrotransport induced by ultrasonic Lamb waves,Ó Applied Physics Letters, 59, 7, 774-776, (1991).
67. R. S. Muller and R. T. Howe, ÒTechnologies for microdynamic devices,Ó Nanotechnology, 1, 8-12, (1990).
68. K. S. Udell, A. P. Pisano, R. T. Howe, R. M. White, and R. S. Muller, ÒMicrosensors for heat transfer and fluid flow measurements,Ó Experimental Thermal and Fluid Science, 3, 52-59 (1990).
69. S. C. Chang, M. W. Putty, D. B. Hicks, C. H. Li, and R. T. Howe, ÒResonant-Bridge Two-Axis Microaccelerometer,Ó Sensors and Actuators, A21-A23, 342-345, (1990).
70. L.-S. Fan, R. T. Howe, and R. S. Muller, ÒFracture-Toughness Characterization of Brittle Thin Films,Ó Sensors and Actuators, A21-A23, 872-874, (1990).
71. W. C. Tang, T.-C. H. Nguyen, M. W. Judy, and R. T. Howe, ÒElectrostatic-Comb Drive of Lateral Polysilicon Resonators,Ó Sensors and Actuators A, A21-A23, 328-331, (1990).
72. H. R. Wenk, M. Sintubin, J. Huang, G. C. Johnson, and R. T. Howe, J. of Applied Physics, 67, 572-574, (1990).
73. R. T. Howe, ÒMicrosensor and microactuator applications of thin films,Ó Thin Solid Films, 181, 235-243, (1989).
74. J. Huang, R. T. Howe, and H.-S. Lee, ÒVacuum-insulated field-effect transistor,Ó Electronics Letters, 25, 1571-1573, (1989).
75. W. C. Tang, T.-C. H. Nguyen, and R. T. Howe, ÒLaterally driven polysilicon resonant microstructures,Ó Sensors and Actuators, 20, 25-32 (1989).
76. M. W. Putty, S.-C. Chang, R. T. Howe, A. L. Robinson, and K. D. Wise, ÒProcess integration for active polysilicon resonant microstructures,Ó Sensors and Actuators, 20, 143-151, (1989).
77. R. T. Howe, ÒSurface micromachining for microsensors and microactuators,Ó J. of Vacuum Science and Technology, Part B, 6, 1809-1813, (1988).
78. J. T. Kung, H.-S. Lee, and R. T. Howe, ÒA digital readout technique for capacitive sensor applications,Ó IEEE J. of Solid-State Circuits, 23, 972-977, (1988).
79. M. A. Schmidt, R. T. Howe, S. D. Senturia, and J. H. Haritonidis, ÒDesign and calibration of a microfabricated floating-element shear-stress sensor,Ó IEEE Trans. on Electron Devices, 35, 750-757, (1988).
80. S. F. Bart, T. A. Lober, J. H. Lang, R. T. Howe, and M. F. Schlecht, ÒDesign considerations for microfabricated electric actuators,Ó Sensors and Actuators, 14, 269-292, (1988).
81. M. Mehregany, R. T. Howe, and S. D. Senturia, ÒNovel microstructures for the in-situ measurement of mechanical properties of thin films,Ó J. of Applied Physics, 62, 3579-3584, (1987).
82. M. G. Allen, M. Mehregany, R. T. Howe, and S. D. Senturia, ÒMicrofabricated structures for the in-situ measurement of residual stress, YoungÕs modulus, and ultimate strain in polyimide films,Ó Applied Physics Letters, 51, 241-243, (1987).
83. R. T. Howe, ÒPolycrystalline silicon micromachining: a new technology for integrated sensors,Ó Annals of Biomedical Engineering, 14, 187-197, (1986).
84. R. T. Howe and R. S. Muller, ÒResonant-microbridge vapor sensor,Ó IEEE Trans. on Electron Devices, ED-33, 499-506, (1986).
85. R. T. Howe and R. S. Muller, ÒPolycrystalline and amorphous silicon micromechanical beams: annealing and mechanical properties,Ó Sensors and Actuators, 4, 447-454, (1983).
86. R. T. Howe and R. S. Muller, ÒStress in polycrystalline and amorphous silicon thin films,Ó J. of Applied Physics, 54, 4674-4675, (1983).
87. R. T. Howe and R. S. Muller, ÒPolycrystalline silicon micromechanical beams,Ó J. of the Electrochemical Society, 130, 1420-1423, (1983).
Refereed Conference and
Symposium Proceedings
1. J.-H. Lee, I. Bargatin, J. Provine, R. T. Howe, W. A. Clay, N. A. Melosh, Z.-X. Shen, F. Liu, and R. Maboudian, ÒThermionic emission from microfabricated silicon carbide filaments,Ó to be presented at the 9th Int. Conf. on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (Power MEMS 2009), Washington, D.C., Dec. 1-4, 2009.
2.
S. Chong, K. Akarvardar, R. Parsa, J.-B. Yoon, R. T.
Howe, S. Mitra, and H.-S. P. Wong, ÒNanoelectromechanical (NEM) relays
integrated with SRAM for improved stability and low leakage,Ó to be presented
at the IEEE/ACM Int. Conf. on
Computer-Aided Design, San Jose, California, Nov. 2-5, 2009.
3.
T. A. Zangle, R. Kant, R. T. Howe, and J. G. Santiago,
ÒMicrofluidic device with integrated nanopores for protein detection,Ó to be
presented at the 13th Int.
Conf. on Miniaturized Systems for Chemistry and Life Sciences (mTAS 2009), Jeju, Korea, Nov. 1-5, 2009.
4.
J.-W. P.
Chen and R. T. Howe, ÒWafer reconstitution with precision dry front-to-front
registration,Ó 15th Int. Conf.
on Solid-State Sensors, Actuators and Microsystems, Denver, Colorado, June
21-25, 2009.
5.
M. Ziaei-Moayyed, J. Hsieh, J.-W. P. Chen, E. P. QuŽvy,
D. Elata, and R. T. Howe, ÒHigher-order mode internal electrostatic
transduction of a bulk-mode ring resonator on a quartz substrate,Ó 15th Int. Conf. on Solid-State
Sensors, Actuators and Microsystems, Denver, Colorado, June 21-25, 2009.
6.
K. L. Tsai, D. Pickard, J. Kao, X. Yin, B. Leen, K.
Knutson, R. Kant, and R. T. Howe, ÒMagnetic nanoparticle-driven pumping in
microchannels,Ó 15th Int.
Conf. on Solid-State Sensors, Actuators and Microsystems, Denver, Colorado,
June 21-25, 2009.
7.
K.-L. Chen, S. Wang, J. Salvia, R. T. Howe, and T. W.
Kenny, ÒEncapsulated out-of-plane differential square-plate resonators with
integrated actuation electrodes,Ó 15th
Int. Conf. on Solid-State Sensors, Actuators and Microsystems, Denver,
Colorado, June 21-25, 2009.
8.
C. S. Roper, R. Candler, S. Yoneoka, T. Kenny, R. T.
Howe, and R. Maboudian, ÒSimultaneous wafer-scale vacuum encapsulation and
microstructure cladding with LPCVD polycrystalline 3C-SiC,Ó 15th Int. Conf. on Solid-State
Sensors, Actuators and Microsystems, Denver, Colorado, June 21-25, 2009.
9.
R. Kant, M. Ziaei-Moayyed, and R. T. Howe, ÒSuspended
microstructures made using silicon microstructures,Ó 15th Int. Conf. on Solid-State Sensors, Actuators and
Microsystems, Denver, Colorado, June 21-25, 2009.
10.
N. Klejwa, R. Misra, J. Provine, S. J. Klejwa, M.
Zhang, S.-X. Wang, and R. T. Howe, ÒLaser-printed magnetic-polymer
microstructures,Ó 15th Int.
Conf. on Solid-State Sensors, Actuators and Microsystems, Denver, Colorado,
June 21-25, 2009.
11.
J Provine, N. Ferralis, N. Klejwa, C. Carraro, R.
Maboudian, and R. T. Howe, ÒEpitaxial growth of graphene on high topology SiC
structures patterned by focused ion beam,Ó 53rd International
Conference on Electron, Ion, and Photon Beam Technology and Nanofabrication,
Marco Island, Florida, May 26-29, 2009.
12.
N. Klejwa, R. Misra, S. J. Klejwa, and R. T. Howe,
ÒLaser print patterning of planar spiral inductors,Ó 53rd International Conference on Electron, Ion, and Photon
Beam Technology and Nanofabrication, Marco Island, Florida, May 26-29,
2009.
13.
G. Thareja, R. Kant, R. Howe, and Y. Nishi, ÒStructural
transformation of silicon due to hydrogen ambient during germanium epitaxy on
silicon nano-pillars,Ó Materials Research
Society Spring Meeting, San Francisco, California, April 13-17, 2009.
14. A. B. Graham, M. Messana, P. Hartwell, J Provine, S. Yoneoka, B. Kim, R. Melamud, R. T. Howe, and T. W. Kenny, ÒWafer scale encapsulation of large lateral deflection MEMS structures,Ó 22nd IEEE Micro Electro Mechanical Systems Conference, Sorrento, Italy, January 25-29, Sorrento, Italy.
15. K.-L.Chen, H. Chandrahalim, A. B. Graham, S. A. Bhave, R. T. Howe, and T. W. Kenny, ÒEpitaxial silicon microshell vacuum-encapsulated CMOS-compatible 200 MHz bulk-mode resonator,Ó ,Ó 22nd IEEE Micro Electro Mechanical Systems Conference, Sorrento, Italy, January 25-29, Sorrento, Italy.
16.
M. Ziaei-Moayyed, D. Elata, J. Hsieh, J.-W. Chen, E. P.
QuŽvy, and R. T. Howe, ÒFully differential interal electrostatic transduction
of a LamŽ-mode resonator,Ó 22nd
IEEE Micro Electro Mechanical Systems Conference, Sorrento, Italy, January
25-29, Sorrento, Italy.
17. J Provine, C. Roper, J. Schuller, M. Brongersma, R. Maboudian, R.T. Howe, ÒThe Dependence of Poly-Crystalline SiC Mid-Infrared Optical Properties on Deposition Conditions,Ó IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, Freiburg, Germany, August 11-14, 2008.
18. K. Arkarvardar, D. Elata, R. T. Howe, H.-S. P. Wong, ÒEnergy-reversible complementary NEM logic gates,Ó 66th IEEE Device Research Conference, Santa Barbara, California, June 25-28, 2008.
19. G. Bahl, R. Melamud, B. Kim, S. Chandorkar, J. Salvia, M. A. Hopcroft, R. A. Hennessey, S. Yoneoka, C. M. Jha, G. Yama, D. Elata, R. N. Candler, R. T. Howe, and T. W. Kenny, ÒObserations of fixed and mobile charge in composite MEMS resonators,Ó 13th Solid-State Sensors, Actuators, and Microsystems Workshop, Hilton Head, South Caroline, June 1-5, 2008, pp. 102-105.
20. D. Elata, R. Hennessy, V. Leus, N. Klejwa, A. Hirshberg, J. Provine, and R. T. Howe, ÒMeasuring charge and charge-decay in floating electrode electrostatic MEMS actuators,Ó 13th Solid-State Sensors, Actuators, and Microsystems Workshop, Hilton Head, South Caroline, June 1-5, 2008, pp. 178-181.
21. K. L. Tsai, M. Ziaei-Moayyed, N. Klejwa, R. N. Candler, W. Hu, S. X. Wang, and R. T. Howe, ÒCharacterization of magnetic nanoparticle-embedded SU8 for microactuation,Ó 13th Solid-State Sensors, Actuators, and Microsystems Workshop, Hilton Head, South Caroline, June 1-5, 2008, pp. 162-165.
22. S. Kim, R. Kant, S. Hadzialic, R. T. Howe, O.
Solgaard, ÒInterface quality control of monolithic photonic crystals by
hydrogen annealing,Ó Conference on Lasers
and Electro-Optics (CLEO) 2008,
San Jose, California, May 6-8 2008.
23. N. Arellano, E. P. QuŽvy, J. Provine, R. Maboudian, and R. T. Howe, ÒNanowire coupled micro-resonators,Ó 21th IEEE Micro Electro Mechanical Systems Conference, Tucson, Arizona, January 13-16, 2008.
24. K. Akarvardar, D. Elata, R. Parsa, G. C. Wan, K. Yoo, J. Provine, P. Peumans, R. T. Howe, and H.-S. P. Wong, ÒDesign considerations for complementary nanoeletromechanical logic gates,Ó IEEE Int. Electron Devices Meeting, Washington, D.C., December 10-12, 2007.
25. J. Provine, P. B. Catrysse, C. Roper, R. Maboudian. S. Fan, and R. T. Howe, ÒPhonon polaritron reflectance spectra in a silicon carbide membrane hole array,Ó Annual Meeting of the IEEE Laser and Electro-Optics Society, Lake Buena Vista, Florida, October 21-25, 2007.
26. J. Provine, P. B. Catrysse, C. Roper, R. Maboundian, S. Fan, and R. T. Howe, ÒExtraordinary transmission through a poly-SiC membrane with subwavelength hole arrays,Ó IEEE Optical MEMS and Nanophotonics Workshop, Hualien, Taiwan, Aug. 12-16, 2007.
27. H. Chandrahalim, S. A. Bhave, E. P. QuŽvy, and R. T. Howe, ÒAqueous transduction of poly-SiGe disk resonators,Ó 14th Int. Conf. on Solid-State Sensors, Actuators and Microsystems, Lyon France, June 10-14, 2007.
28. F. J. Zendejas, U. Srinivasan, W. J. Holtz, J. D. Keasling, and R. T. Howe, ÒMicrofluidic generation of tunable monodisperse double emulsions for templated silica particles,Ó 10th Int. Conf. on Miniaturized Systems for Chemistry and Life Sciences, Tokyo, Japan, Nov. 5-9, 2006.
29. E. P. QuŽvy, R. T. Howe, and T.-J. King, ÒReconstituted wafer technology for heterogeneous integration,Ó 19th IEEE Micro Electro Mechanical Systems Conference, Istanbul, Turkey, January 22-26, 2006, pp. 302-305.
30. E. P. QuŽvy, A. San Paulo, E. Basol, R. T. Howe, T.-J. King, and J. Bokor, ÒBack-end-of-line poly-SiGe disk resonators,Ó 19th IEEE Micro Electro Mechanical Systems Conference, Istanbul, Turkey, January 22-26, 2006, pp. 234-237.
31. H. Kam, R. T. Howe, and T.-J. King, ÒA new nano-electro-mechanical field effect transistor (NEMFET) for low-power electronics,Ó IEEE Int. Electron Devices Meeting, December 5-7, 2005, Washington, DC.
32. T. Koyama, D. S. Bindel, W. He, E. P. QuŽvy, S. Govindjee, J. W. Demmel, and R. T. Howe, ÒSimulation tools for damping in high frequency resonators,Ó IEEE Sensors Conference, Irvine, California, October 31 – November 2, 2005.
33. E. P. QuŽvy and R. T. Howe, ÒRedundant MEMS resonators for precise reference oscillators,Ó (invited), IEEE Radio Frequency Integrated Circuits Symposium, Long Beach, California, June 12-14, 2005, pp. 113-116.
34. S. A. Bhave and R. T. Howe, ÒSilicon nitride-on-silicon bar resonator using internal electrostatic transduction,Ó 13th International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers Õ05), Seoul, Korea, June 5-9, 2005.
35. F. J. Zendejas, U. Srinivasan, W. J. Holtz, J. D. Keasling, and R. T. Howe, ÒMicrofluidic generation of tunable emulsions for templated monodisperse silica,Ó 13th International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers Õ05), Seoul, Korea, June 5-9, 2005.
36. S. A. Bhave, D. Gao, R. Maboudian, and R. T. Howe, ÒFully differential poly-SiC LamŽ-mode resonator and checkerboard filter,Ó 18th IEEE Micro Electro Mechanical Systems Conference (MEMS-05), Miami, Florida, January 30 – February 3, 2005.
37. D. S. Bindel, E. QuŽvy, S. Govinjee, J. W. Demmel, and R. T. Howe, ÒAnchor loss simulation in resonators,Ó 18th IEEE Micro Electro Mechanical Systems Conference (MEMS-05), Miami, Florida, January 30 – February 3, 2005.
38. C. W. Low, B. L. Bircumshaw, T. Dorofeeva, G.
Solomon, T. -J. King and R. T.
Howe, ÒStress Stability of Poly-SiGe and Various Oxide Films in Humid
Environments,Ó Stability of Thin Films
and Nanostructures Symposium,
Materials Research Society, Boston, Mass., Nov. 29 - Dec. 3, 2004
39. C. W. Low, M. L. Wasilik, H.Takeuchi, T.-J. King, and R. T. Howe, ÒIn-situ doped poly-SiGe LPCVD process using BCl3 for post-CMOS integration of MEMS devices,Ó SiGe Materials, Processing, and Device Symposium, Electrochemical Society Fall Meeting, Honolulu, Hawaii, October 3-8, 2004. P. 1384.
40. S. A. Bhave and R. T. Howe, ÒInternal electrostatic transduction for bulk-mode MEMS resonators,Ó (late news paper) 11th Solid-State Sensor, Actuator, and Microystems Workshop, Hilton Head Island, South Carolina, June 6-10, 2004, pp. 59-60.
41. D. Gao, W. R. Ashurst, C. Carraro, R. T. Howe, and R. Maboudian, ÒSilicon carbide for enhanced MEMS reliability,Ó 11th Solid-State Sensor, Actuator, and Microystems Workshop, Hilton Head Island, South Carolina, June 6-10, 2004, pp. 192-195.
42. M.-A. N. Eyoum, Y. R. Su, B. L. Bircumshaw, D. Kouzimov, H. Takeuchi, R. T. Howe, and T.-J. King, ÒEffects of boron concentration on Si1-xGex properties for integrated MEMS technology,Ó 11th Solid-State Sensor, Actuator, and Microystems Workshop, Hilton Head Island, South Carolina, June 6-10, 2004, pp. 246-249.
43. E. P. QuŽvy, S. A. Bhave, H. Takeuchi, T.-J. King, and R. T. Howe, ÒPoly-SiGe high frequency resonators based on lithographic definition of nano-gap lateral transducers,Ó 11th Solid-State Sensor, Actuator, and Microystems Workshop, Hilton Head Island, South Carolina, June 6-10, 2004, pp. 360-363.
44. A. S. Phani, A. A. Seshia, M. Palaniapan, and R. T. Howe, ÒCoupling of resonant modes in micromechanical vibratory rate gyroscopes,Ó Modeling and Simulation of MEMS (MSM-04), Boston, Mass., March 7-11, 2004, pp. 343-346.
45. B. L. Bircumshaw, M. L. Wasilik, E. B. Kim, Y. R. Su, H. Takeuchi, C. W. Low, A. P. Pisano, T.-J. King, and R. T. Howe, ÒHydrogen peroxide etching and stability of p-type poly-SiGe films,Ó 17th IEEE Micro Electro Mechanical Systems Conference (MEMS-04), Maastricht, The Netherlands, January 25-29, 2004, pp. 514-519.
46. B. C. Y. Lin, T.-J. King, and R. T. Howe, ÒOptimization of poly-SiGe deposition processes for modular MEMS integration,Ó Micro- and Nanosystems Symposium, December 1-3, 2003, Boston, Mass., pp. 43-48.
47. B. Bircumshaw, G. Liu, H. Takeuchi, T.-J. King, R. Howe, O. OÕReilly, and A. Pisano, ÒThe radial bulk annular resonator: towards a 50W RF MEMS filter,Ó 12th Int. Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers Õ03), Boston, Mass., June 8-12, 2003, pp. 875-878.
48. S. A. Bhave, J. I. Seeger, X. Jiang, B. E. Boser, R. T. Howe, and J. Yasaitis, ÒAn integrated, vertical drive, in-plane-sense microgyroscope,Ó 12th Int. Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers Õ03), Boston, Mass., June 8-12, 2003, pp. 171-174.
49. D. Gao, B. J. Wijesundara, C. Carraro, C. W. Low, R. T. Howe, and R. Maboudian, ÒHigh modulus polycrystalline 3C-SiC technology for RF MEMS,Ó 12th Int. Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers Õ03), Boston, Mass., June 8-12, 2003, pp. 1160-1163.
50. K. L. Scott, R. T. Howe, and C. J. Radke, ÒModel for micropart planarization in capillary-based microassembly,Ó 12th Int. Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers Õ03), Boston, Mass., June 8-12, 2003, pp. 1319-1322.
51. M. Palaniapan, R. T. Howe, and J. Yasaitis, ÒIntegrated Z-axis frame microgyroscope with ISOD design,Ó 16th IEEE Micro Electro Mechanical Systems Conference, Kyoto, Japan, January 2003, pp. 482-485.
52. J. Yasaitis, M. Judy, T. Brosnihan, P. Garone, N. Pokrovskiy, D. Sniderman, S. Limb, R. Howe, B. Boser, M. Palaniapan, X. Jiang, and S. Bhave, ÒA modular process for integrating thick polysilicon MEMS devices with sub-micron CMOS,Ó Proceedings of SPIE, 4979, Micromachining and Microfabrication Process Technology VII, edited by John A. Yasaitis, Mary Ann Perez-Maher, Jean Michel Karam, (SPIE, Bellingham, WA, 2003).
53. T.-J. King, R. T. Howe, S. Sedky, G. Liu, B. C.-Y. Lin, M.Wasilik, and C. DŸnn (invited), ÒRecent progress in modularly integrated MEMS technologies,Ó IEEE International Electron Devices Meeting, San Francisco, Calif., December 9-11, 2002, pp. 199-202.
54. M. Palaniapan, R. T. Howe, and J. Yasaitis, ÒIntegrated surface-micromachined Z-axis frame microgyroscope,Ó IEEE International Electron Devices Meeting, San Francisco, Calif., December 9-11, 2002, pp. 203-206.
55. S. Sedky, J. Schroeder, T. Sands, R. Howe, and T.-J. King, ÒPulsed laser annealing of silicon germanium films,Ó MRS Proceedings, 741, Boston, Mass., December 2002, pp. J4.2.1-J4.2.6.
56. T.-J. King, R. T. Howe, M.-A. Eyoum, and S. A. Bhave, ÒInterconnect issues for integrated MEMS technologies,Ó (invited) Advanced Metallization Conference, San Diego, Calif., October 2002.
57. X. Jiang, S. A. Bhave, J. I. Seeger, R. T. Howe, B. E. Boser, and J. Yasaitis, ÒSD Capacitive Interface for a Vertically Driven X&Y-Axis Rate Gyroscope,Ó European Solid-State Circuits Conference, Bologna, Italy, September 2002, 639-642
58. S. A. Bhave, B. L. Bircumshaw, Y.-S. Kim, W. Z. Low, T.-J. King, and R. T. Howe, ÒPoly-SiGe: a high-Q structural material for integrated RF MEMS,Ó 10th Solid-State Sensors, Actuators, and Microsystems Workshop, Hilton Head Island, S.C., June 2-6, 2002, pp. 34-37.
59. M. M. Maharbiz, W. J. Holtz, J. D. Keasling, and R. T. Howe, ÒA microfabricated electrochemical oxygen generator for high-density cell culture arrays,Ó 10th Solid-State Sensors, Actuators, and Microsystems Workshop, Hilton Head Island, S.C., June 2-6, 2002, pp. 259-263.
60. P. Riehl, K. Scott, R. S. Muller, and R. T. Howe, ÒHigh-resolution electrometer with micromechanical variable capacitor,Ó 10th Solid-State Sensors and Actuators Workshop, Hilton Head Island, S.C., June 2-6, 2002, pp. 305-308.
61. A. A. Seshia, W. Z. Low, S. A. Bhave, and R. T. Howe, ÒMicromechanical Pierce oscillator for resonator sensor applications,Ó Modeling and Simulation of Microsystems Workshop, San Juan, Puerto Rico, April 22-25, 2002, pp. 162-165.
62. R. T. Howe and T.-J. King, ÒLow-temperature LPCVD MEMS technologies,Ó MRS Symposium on BioMEMS and Bionanotechnologies, MRS Proceedings, 729, San Francisco, Calif., April 1-4, 2002, paper U5.1, 205-213.
63. A. A. Seshia, R. T. Howe, and S. Montague, ÒAn integrated microelectromechanical resonant-output gyroscope,Ó 15th IEEE Micro Electro Mechanical Systems Conference (MEMS 2002), Las Vegas, Nevada, January 2002, pp. 722-726.
64. M. A. Helmbrecht, U. Srinivasan, C. Rembe, R. T. Howe, and R. S. Muller, ÒMicromirrors for adaptive optics,Ó 11th Int. Conf. on Solid-State Sensors and Actuators (Transducers 01), Munich, Germany, June 10-14, 2001, pp. 1290-1293.
65. C. Rembe, L. Muller, R. S. Muller, A. P. Pisano, and R. T. Howe, ÒFull three-dimensional motion characterization of a gimballed electrostatic microactuator,Ó IEEE Int. Reliability Physics Symposium, Orlando, Florida, April 30-May 3, 2001, pp. 91-98.
66. K. F. Bšhringer, U. Srinivasan, and R. T. Howe, ÒModeling of capillary forces and binding sites for fluidic self-assembly,Ó 14th IEEE Micro Electro Mechanical Systems Conference (MEMS 2001), Interlaken, Switzerland, Jan. 21-25, 2001, pp. 369-374.
67. M. Maharbiz, R. T. Howe, and J. D. Keasling, ÒSilicon microbial bioreactor arrays,Ó 1st Int. IEEE-EMBS Conf. on Microtechnologies in Medicine & Biology, Lyon, France, Oct. 12-14, 2000, pp. 165-170.
68. U. Srinivasan, M. Helmbrecht, C. Rembe, R. S. Muller, and R. T. Howe, ÒFluidic self-assembly of micromirrors onto surface micromachined actuators,Ó IEEE/LEOS Int. Conf. on Optical MEMS, Kawai, Hawaii, August 21-24, 2000, pp. 59-60.
69. C. Rembe, M. Hart, M. A. Helmbrecht, U. Srinivasan, R. S. Muller, K. Y. Lau, and R. T. Howe, ÒStroboscropic interferometer with variable magnification to measure dynamics in an adaptive-optics micromirror,Ó IEEE/LEOS Int. Conf. on Optical MEMS, Kawai, Hawaii, August 21-24, 2000, pp. 73-74.
70. A. E. Franke, Y. Jiao, M. T. Wu, T.-J. King, and R. T. Howe, ÒPost-CMOS modular integration of poly-SiGe microstructures using poly-Ge sacrificial layers,Ó 9th Solid-State Sensor and Actuator Workshop, Hilton Head, South Carolina, June 4-8, 2000, pp. 18-21.
71. W. R. Ashurst, C. Yao, C. Carraro, R. T. Howe, and R. Maboudian, ÒAlkene based monolayer films as anti-stiction coatings for polysilicon MEMS,Ó 9th Solid-State Sensor and Actuator Workshop, Hilton Head, South Carolina, June 4-8, 2000, pp. 320-333.
72. E. E. Hui, R. T. Howe, and M. S. Rodgers, ÒSingle-step assembly of complex 3-D microstructures,Ó 13th IEEE Micro Electro Mechanical Systems Workshop (MEMS 2000), Miyazaki, Japan, Jan. 2000, pp. 602-607.
73. L. Muller, J. M. Heck, R. T. Howe, and A. P. Pisano, ÒElectrical isolation process for molded, high-aspect-ratio polysilicon microstructures,Ó 13th IEEE Micro Electro Mechanical Systems Workshop (MEMS 2000), Miyazaki, Japan, Jan. 2000, pp. 590-595.
74. P. T. Jones, G. C. Johnson, and R. T. Howe, "Materials characterization for MEMS - a comparison of uniaxial and bending tests," SPIE Micromachining and Microfabrication Symposium, Santa Clara, Calif., Sept. 1999.
75. P. T. Jones, G. C. Johnson, and R. T. Howe, ÒStatistical characterization of fracture of brittle MEMS materials,Ó SPIE Micromachining and Microfabrication Symposium, Santa Clara, Calif., Sept. 1999.
76. A. Singh, D. Bilic, and R. T. Howe, ÒPerformance evaluation of batch-transferred surface micromachined resonators,Ó 10th Int. Conf. on Solid-State Sensors and Actuators (Transducers 99), Sendai, Japan, June 7-11, 1999, pp. 1158-1161.
77. O. Tabata, T. Yamamoto, A. A. Seshia, and R. T. Howe, ÒIntegrated resonant accelerometer based on rigidity change,Ó 10th Int. Conf. on Solid-State Sensors and Actuators (Transducers 99), Sendai, Japan, June 7-11, 1999, pp. 1538-1541.
78. D. Bilic, R. T. Howe, W. A. Clark, and T. A. Roessig, ÒThird harmonic double-ended tuning fork resonator,Ó 10th Int. Conf. on Solid-State Sensors and Actuators (Transducers 99), Sendai, Japan, June 7-11, 1999, pp. 1824-1825.
79. A. E. Franke, D. Bilic, D. T. Chang, P. T. Jones, T.-J. King, R. T. Howe, and G. C. Johnson, ÒOptimization of poly-silicon-germanium as a microstructural material,Ó 10th Int. Conf. on Solid-State Sensors and Actuators (Transducers 99), Sendai, Japan, June 7-11, 1999, pp. 530-533.
80. J. M. Heck, C. G. Keller, A. E.Franke, L. Muller, T.-J. King, and R. T. Howe, ÒHigh aspect ratio poly-silicon-germanium microstructures,Ó 10th Int. Conf. on Solid-State Sensors and Actuators (Transducers 99), Sendai, Japan, June 7-11, 1999, pp. 328-331.
81. L. Muller, J. M. Noworolski, R. T. Howe, and A. P. Pisano, ÒMechanical performance of an integrated microgimbal / microactuators for disk drives,Ó 10th Int. Conf. on Solid-State Sensors and Actuators (Transducers 99), Sendai, Japan, June 7-11, 1999, pp. 1002-1005.
82. U. Srinivasan, R. T. Howe, and D. Liepmann, ÒFluidic microassembly using patterned self-assembled monolayers and shape matching,Ó10th Int. Conf. on Solid-State Sensors and Actuators (Transducers 99), Sendai, Japan, June 7-11, 1999, 1170-1173.
83. M. Maharbiz, R. T. Howe, and K. S. J. Pister, ÒBatch transfer assembly of micro-components onto surface and SOI MEMS,Ó 10th Int. Conf. on Solid-State Sensors and Actuators (Transducers 99), Sendai, Japan, June 7-11, 1999, pp. 1478-1481.
84. A. M. Shkel, R. Horowitz, A. A. Seshia, S. Park, and R. T. Howe, ÒDynamics and control of micromachined gyroscopes,Ó Proceedings, American Control Conference, San Diego, Calif., June 2-4, 1999.
85. A. M. Shkel, R. T. Howe, and R. Horowitz, ÒModeling and simulation of micromachined gyroscopes in the presence of imperfections,Ó Int. Conf. On Modeling and Simulation of Microsystems (MSM 99), San Juan, Puerto Rico, April 1999.
86. A. E. Franke, D. Bilic, D. T. Chang, P. T. Jones, T.-J. King, R. T. Howe, and G. C. Johnson, ÒPost-CMOS integration of germanium microstructures,Ó 12th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS 99), Orlando, Florida, Jan. 17-21, 1999, pp. 630-637.
87. K. S. Lebouitz, A. Mazaheri, R. T. Howe, and A. P. Pisano, ÒVacuum encapsulation of resonant devices using permeable polysilicon,Ó 12th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS 99), Orlando, Florida, Jan. 17-21, 1999, pp. 470-475.
88. M. M. Maharbiz, M. B. Cohn, R. T. Howe, R. Horowitz, and A. P. Pisano, ÒBatch micropackaging by compression-bonded wafer-wafer transfer,Ó 12th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS 99), Orlando, Florida, Jan. 17-21, 1999, pp. 482-489.
89. M. B. Cohn, K. F. Bohringer, J. M. Noworolski, A. Singh, C. G. Keller, K. Y. Goldberg, and R. T. Howe, ÒMicroassembly technologies for MEMS,Ó (invited plenary paper), SPIE Micromachining and Microfabrication Symposium, Santa Clara, Calif., Sept. 20-22, 1998, SPIE Proc. 3511, pp. 2-16.
90. E. E. Hui, C. G. Keller, and R. T. Howe, ÒCarbonized parylene as a conformal sacrificial layer for high aspect ratio molded polysilicon,Ó 8th Solid-State Sensor and Actuator Workshop, Hilton Head, S.C., June 7-11, 1998, pp. 256-260.
91. T. A. Roessig, R. T. Howe, A. P. Pisano, and J. H. Smith, ÒSurface-micromachined 1 MHz oscillator with low-noise Pierce configuration,Ó 8th Solid-State Sensor and Actuator Workshop, Hilton Head, S.C., June 7-11, 1998, pp. 328-332.
92. U. Srinivasan, J. D. Foster, R. Maboudian, R. T. Howe, D. C. Senft, and M. D. Dugger, ÒLubrication of polysilicon micromechanisms with self-assembled monolayers,Ó 8th Solid-State Sensor and Actuator Workshop, Hilton Head, S.C., June 7-11, 1998, pp. 156-161.
93. K.-F. Bohringer, K. Goldberg, M. Cohn, R. Howe, and A. Pisano, ÒParallel microassembly with electrostatic force fields,Ó Int. Conference on Robotics and Automation, Leuven, Belgium, May 1998.
94. P. T. Jones, G. C. Johnson, and R. T. Howe, ÒFracture strength of polycrystalline silicon,Ó MRS, San Francisco, Calif., April 1998.
95. J. T. Feddema, C. G. Keller, and R. T. Howe, ÒExperiments in micromanipulation and CAD-driven microassembly,Ó SPIE Symposium on Microrobotics and Microsystem Fabrication, 3202, Pittsburgh, Pa., Oct. 16-17, 1997, pp. 98-107.
96. A. Singh, D. A. Horsley, M. B. Cohn, A. P. Pisano, and R. T. Howe, ÒBatch transfer of microstructures using flip-chip solder bump bonding,Ó 9th International Confernence on Solid-State Sensors and Actuators (Transducers 97), Chicago, Ill., June 16-19, 1997, pp. 265-268.
97. T. J. Brosnihan, J. M. Bustillo, A. P. Pisano, and R. T. Howe, ÒEmbedded interconnect and electrical isolation for high-aspect-ratio, SOI inertial instruments,Ó 9th International Confernence on Solid-State Sensors and Actuators (Transducers 97), Chicago, Ill., June 16-19, 1997, pp. 637-641.
98. T. A. Roessig, R. T. Howe, and A. P. Pisano, ÒSurface-micromachined resonant accelerometer,Ó 9th International Confernence on Solid-State Sensors and Actuators (Transducers 97), Chicago, Ill., June 16-19, 1997, pp. 859-862.
99. U. Srinivasan, M. R. Houston, R. T. Howe, and R. Maboudian, ÒSelf-assembled fluorocarbon films for enhanced stiction reduction,Ó 9th International Confernence on Solid-State Sensors and Actuators (Transducers 97), Chicago, Ill., June 16-19, 1997, pp. 1399-1402.
100. T. A. Roessig, R. T. Howe, and A. P. Pisano, ÒNonlinear mixing in surface-micromachined tuning fork oscillators,Ó IEEE Frequency Control Symposium, Orlando, Florida, May 27-29, 1997.
101. C. G. Keller and R. T. Howe, ÒHexsil tweezers for teleoperated micro-assembly,Ó IEEE 10th Int. Workshop on Micro Electromechanical Systems (MEMS 97), Nagoya, Japan, Jan. 26-30, 1997, pp. 72-77.
102. W. A. Clark, R. T. Howe, and R. Horowitz, ÒZ-axis vibratory rate gyroscope,Ó AVS Micromachining Workshop III - Technology and Applications, Anaheim, Calif., Sept. 24-26, 1996.
103. P. T. Jones, G. C. Johnson, and R. T. Howe, ÒMicromechanical structures for fracture testing of brittle thin films,Ó Symp. on Microelectromechanical Systems (MEMS), vol. DSC-59, ASME Int. Conf. and Exp., Atlanta, Georgia, Nov. 1996, pp. 325-330.
104. C. G. Keller and R. T. Howe, ÒHexsil tweezers with polysilicon piezoresistive strain gauges,Ó Late News Digest, 7th Solid-State Sensor and Actuator Workshop, Hilton Head Island, S. C., June 2-6, 1996, pp. 31-32.
105. W. A. Clark, R. T. Howe, and R. Horowitz, ÒSurface micromachined Z-axis vibratory rate gyroscope,Ó 7th Solid-State Sensor and Actuator Workshop, Hilton Head Island, S. C., June 2-6, 1996, pp. 299-302.
106. M. R. Houston, R. Maboudian, and R. T. Howe, ÒSelf-assembled monolayers as permanent anti-stiction coatings for polysilicon microstructures,Ó 7th Solid-State Sensor and Actuator Workshop, Hilton Head Island, S. C., June 2-6, 1996, pp. 42-47.
107. M. B. Cohn, Y. Liang, R. T. Howe, and A. P. Pisano, ÒWafer-to-wafer microstructure transfer for vacuum packaging,Ó 7th Solid-State Sensor and Actuator Workshop, Hilton Head Island, S. C., June 2-6, 1996, pp. 32-35.
108. T. A. Roessig, A. P. Pisano, and R. T. Howe, ÒSurface micromachined resonant force sensors,Ó ASME Int. Congress and Exposition, Symposium on Micromechanical Systems, San Francisco, Calif., vol. DSC 57-2, Nov. 12-17, 1995, pp. 871-876.
109. M. B. Cohn, R. T. Howe, and A. P. Pisano, ÒSelf-assembly of microsystems using non-contact electrostatic traps,Ó ASME Int. Congress and Exposition, Symposium on Micromechanical Systems, San Francisco, Calif., Nov. 12-17, 1995, pp. 893-900.
110. T. J. Brosnihan, A. P. Pisano, and R. T. Howe, ÒSurface micromachined angular accelerometer with force feedback,Ó ASME Int. Congress and Exposition, Symposium on Micromechanical Systems, San Francisco, Calif., vol. DSC 57-2, Nov. 12-17, 1995, pp. 941-947.
111. C. G. Keller and R. T. Howe, ÒHigh aspect ratio molded CVD silicon MEMS,Ó AVS Micromachining Workshop II -Technology and Applications, Anaheim, Calif., Sept. 27-28, 1995.
112. R. T. Howe, ÒPolysilicon Integrated Microsystems: Technologies and Applications,Ó (invited plenary talk), 8th Int.Conf. on Solid-State Sensors and Actuators (Transducers 95) and Eurosensors IX, Stockholm, Sweden, June 25-29, 1995, vol. 1, pp. 43-46.
113. M. Biebl, G. Brandl, and R. T. Howe, ÒYoung's Modulus of in-situ Phophorus-Doped Polysilicon,Ó 8th Int. Conf. on Solid-State Sensors and Actuators (Transducers 95) and Eurosensors IX, Stockholm, Sweden, June 25-29, 1995, vol. 2, pp. 80-83.
114. M. Biebl, G. T. Mulhern, and R. T. Howe, ÒIn Situ Phosphorus Doped Polysilicon for Integrated MEMS,Ó 8th Int. Conf. on Solid-State Sensors and Actuators (Transducers 95) and Eurosensors IX, Stockholm, Sweden, June 25-29, 1995, vol. 1, pp. 198-201.
115. K. H.-L. Chau, S. R. Lewis, Y. Zhao, R. T. Howe, S. F. Bart, and R. G. Marcheselli, ÒAn integrated force-balanced capacitive accelerometer for low-G applications,Ó 8th Int. Conf. on Solid-State Sensors and Actuators (Transducers 95) and Eurosensors IX, Stockholm, Sweden, June 25-29, 1995, vol. 1, pp. 593-596.
116. C. G. Keller and R. T. Howe, ÒHexsil bimorphs for vertical actuation,Ó 8th Int. Conf. on Solid-State Sensors and Actuators (Transducers 95) and Eurosensors IX, Stockholm, Sweden, June 25-29, 1995, vol. 1, pp. 99-102.
117. C. G. Keller and R. T. Howe, ÒNickel-filled thermally actuated hexsil tweezers,Ó 8th Int. Conf. on Solid-State Sensors and Actuators (Transducers '95) and Eurosensors IX, Stockholm, Sweden, June 25-29, 1995, vol. 2, pp. 376-379.
118. K. S. Lebouitz, R. T. Howe, and A. P. Pisano, ÒPermeable Polysilicon Microshell Etch-Access Windows,Ó 8th Int. Conf.on Solid-State Sensors and Actuators (Transducers 95) and Eurosensors IX, Stockholm, Sweden, June 25-29, 1995, vol. 1, pp. 224-227.
119. M. R. Houston, R. T. Howe, and R. Maboudian, ÒAmmonium Fluoride Surface Treatments for Reducing In-Use Stiction in Polysilicon Microstructures,Ó 8th Int. Conf. on Solid-State Sensors and Actuators (Transducers 95) and Eurosensors IX, Stockholm, Sweden, June 25-29, 1995, vol. 1, pp. 210-213.
120. R. T. Howe, ÒRecent Advances in Surface Micromachining,Ó 13th Sensor Symposium, (invited plenary talk), IEE Japan, Tokyo, Japan, June 7-9, 1995, pp. 1-8.
121. B. E. Boser and R. T. Howe, ÒSurface Micromachined Accelerometers,Ó (invited) IEEE Custom Integrated Circuits Conference, Santa Clara, Calif., May 1-4, 1995, pp. 337-344.
122. M. R. Houston, R. T. Howe, K. Komvopoulos, and R. Maboudian, ÒDiamond-like carbon for silicon passivation in micromechanical devices,Ó Materials Research Society Spring Meeting, Symposium I: Mechanical Behavior of Diamond and other Forms of Carbon, San Francisco, Calif., April. 17-21, 1995, MRS Sympositum Proceedings, 383, Behavior of Diamond and Other Forms of Carbon, M. D. Drory, D. B. Bogy, M. S. Donley, and J. E. Field, eds., 1995, pp. 391-402.
123. R. S. Payne, S. Sherman, S. Lewis, and R. T. Howe, "Surface Micromachining: from Vision to Reality to Vision,Ó (invited) IEEE Int. Solid-State Circuits Conference, San Francisco, Calif., February 14-16, 1995, 160-161.
124. R. T. Howe and C. T.-C. Nguyen, ÒMicromechanical Resonators for Frequency References and Signal Processing,Ó (invited), IEEE Int. Electron Devices Meeting, San Francisco, Calif., December 12-14, 1994.
125. C. T.-C. Nguyen and R. T. Howe, ÒPolysilicon microresonators for signal processing,Ó (invited), Government Microcircuits Applications Conference (GOMAC), San Diego, Calif., 20, November 7-10, 1994, pp. 195-198.
126. M. R. Houston, R. Maboudian, and R. T. Howe, ÒSilicon Surface Treatments for Stiction Reduction in Silicon Micromachining : A Surface Science Approach,Ó American Institute of Chemical Engineers, San Francisco, Calif., November 1994.
127. R. T. Howe, ÒPolysilicon Integrated Mechatronics: Applications and Recent Developments,Ó (invited keynote talk), 5th Symposium on Micro Machine and Human Science, Nagoya, Japan, October 2-4, 1994.
128. G. K. Fedder and R. T. Howe, ÒIntegrated Testbed for Multi-Mode Digital Control of Suspended Microstructures, 6th Solid-State Sensor and Actuator Workshop, Hilton Head, South Carolina, June 13-15, 1994, pp. 145-150.
129. R. T. Howe, ÒSilicon Micromachining for Resonator Fabrication,Ó (invited plenary talk), IEEE Frequency Control Symposium, Boston, Mass., June 1-3, 1994, pp. 2-7.
130. C. T.-C. Nguyen and R. T. Howe, ÒDesign and Performance of CMOS Micromechanical Resonator Oscillators,Ó IEEE Frequency Control Symposium, Boston, Mass., June 1-3, 1994, pp. 127-134.
131. C. T.-C. Nguyen and R. T. Howe, ÒCMOS Micromechanical Resonator Oscillator,Ó IEEE Int. Electron Devices Meeting, Washington, D.C., December 1993, pp. 199-202.
132. R. L. Alley, P. Mai, K. Komvopoulos, and R. T. Howe, ÒSurface roughness modification of interfacial contacts in polysilicon microstructures,Ó 7th Int. Conf.on Solid-State Sensors and Actuators (Transducers 93), Yokohama, Japan, June 7-10, 1993, pp. 288-291.
133. M. W. Judy and R. T. Howe, ÒHighly compliant lateral suspensions using sidewall beams,Ó 7th Int. Conf. on Solid-State Sensors and Actuators (Transducers 93), Yokohama, Japan, June 7-10, 1993, pp. 54-57.
134. L. Lin, K. M. McNair, R. T. Howe, and A. P. Pisano, ÒVacuum encapsulated lateral microresonators,Ó 7th Int. Conf. on Solid-State Sensors and Actuators (Transducers 93), Yokohama, Japan, June 7-10, 1993, pp. 270-273.
135. D. J. Monk, D. S. Soane, R. T. Howe, ÒEnhanced removal of sacrificial layers for silicon surface micromachining,Ó 7th Int. Conf. on Solid-State Sensors and Actuators (Transducers 93), Yokohama, Japan, June 7-10, 1993, pp. 280-283.
136. G. T. Mulhern, D. S. Soane, and R. T. Howe, ÒSupercritical carbon dioxide drying of microstructures,Ó 7th International Conference on Solid-State Sensors and Actuators (Transducers 93), Yokohama, Japan, June 7-10, 1993, pp. 296-299.
137. C. T. Nguyen and R. T. Howe, ÒMicroresonator frequency control using an integrated micro oven,Ó 7th Int. Conf. on Solid-State Sensors and Actuators (Transducers 93), Yokohama, Japan, June 7-10, 1993, pp. 1040-1043.
138. D. J. Monk, P. Krulevitch, R. T. Howe, and G. C. Johnson, ÒStress-corrosion cracking and blistering of thin polycrystalline silicon films in hydrofluoric acid,Ó Symposium on Thin Films: Stresses and Mechanical Properties IV, Materials Research Society Spring Meeting, San Francisco, Calif., May 1993, MRS Symposium Proceedings, vol. 308, pp. 641-646, 1993.
139. Y.-H. Cho, B. M. Kwak, A. P. Pisano, and R. T. Howe, ÒViscous energy dissipation in laterally oscillating planar microstructures: a theoretical and experimental study,Ó 6th IEEE Micro Electro Mechanical Systems Workshop (MEMS 93), Ft. Lauderdale, Florida, February 7-10, 1993, pp. 93-98.
140. M. W. Judy and R. T. Howe, ÒPolysilicon hollow beam lateral resonators,Ó 6th IEEE Micro Electro Mechanical Systems Workshop (MEMS 93), Ft. Lauderdale, Florida, February 7-10, 1993, pp. 265-271.
141. L. Lin, R. T. Howe, A. P. Pisano, ÒA novel micro in situ strain gauge,Ó 6th IEEE Micro Electro Mechanical Systems Workshop (MEMS 93), Ft. Lauderdale, Florida, February 7-10, 1993, pp. 201-206.
142. C. T.-C. Nguyen and R. T. Howe, ÒQuality factor control for micromechanical resonators,Ó IEEE Int. Electron Devices Meeting, San Francisco, Calif., December 14-16, 1992, pp. 505-508.
143. D. J. Monk, D. S. Soane, and R. T. Howe, ÒSacrificial layer etching model for surface micromachining applications,Ó 5th IEEE Solid-State Sensor and Actuator Workshop, Hilton Head Island, S.C., June 21-25, 1992, pp. 46-49.
144. G. K. Fedder, J. C. Chang, and R. T. Howe, ÒThermal microassembly of narrow-gap electrostatic comb-drive structures,Ó 5th IEEE Solid-State Sensor and Actuator Workshop, Hilton Head Island, S.C., June 21-25, 1992, pp. 63-68.
145. W. Yun, R. T. Howe, and P. R. Gray, ÒSurface micromachined, digitally force-balanced accelerometer with integrated CMOS detection circuitry,Ó 5th IEEE Solid-State Sensor and Actuator Workshop, Hilton Head Island, S.C., June 21-25, 1992, pp. 126-131.
146. R. L. Alley, R. T. Howe, and K. Komvopoulos, ÒThe effect of release-etch processing on surface microstructure stiction,Ó 5th IEEE Solid-State Sensor and Actuator Workshop, Hilton Head Island, S.C., June 21-25, 1992, pp. 202-207.
147. P. Krulevitch, G. C. Johnson, and R. T. Howe, ÒStress and microstructure in phosphorus doped polycrystalline silicon,Ó Symposium on ÒSmartÓ Materials Fabrication/Materials for Micro-Electro-Mechanical Systems, Materials Research Society Spring Meeting, San Francisco, Calif., April 27 - May 1, 1992, MRS Symposium Proceedings, vol. 276, pp. 79-84, 1992.
148. R. I. Pratt, G. C. Johnson, R. T. Howe, and D. J. Nikkel, Jr., ÒCharacterization of thin films using micromechanical structures,Ó Symposium on ÒSmartÓ Materials Fabrication/Materials for Micro-Electro-Mechanical Systems, Materials Research Society Spring Meeting, San Francisco, Calif., April 27 - May 1, 1992, MRS Symposium Proceedings, vol. 276, 1992.
149. D. J. Monk, D. S. Soane, and R. T. Howe, ÒSacrificial layer Si02 wet etching for micromachining applications,Ó Symposium on ÒSmartÓ Materials Fabrication/Materials for Micro-Electro-Mechanical Systems, Materials Research Society Spring Meeting, San Francisco, Calif., April 27 - May 1, 1992, MRS Symposium Proceedings, vol. 276, pp. 303-310, 1992.
150. L. Lin, C. T.-C. Nguyen, R. T. Howe, and A. P. Pisano, ÒMicro Electromechanical Filters,Ó 5th IEEE Micro Electro Mechanical Systems Workshop (MEMS 92), Travemuende, Germany, February 4-7, 1992, pp. 226-231.
151. P. Krulevitch, G. C. Johnson, and R. T. Howe, ÒStress and microstructure in LPCVD polysilicon films: experimental results and closed form modeling of stresses,Ó Symposium on Thin Films: Stresses and Mechanical Properties III, Materials Research Society Fall 1991 Meeting, Boston, Mass., December 1991, MRS Symposium Proceedings, vol. 239, 1992.
152. R. M. Moroney, R. M. White, and R. T. Howe, ÒUltrasonically Induced Microtransport with Cylindrical Geometry,Ó Micromechanical Sensors, Actuators, and Systems Symposium, vol. DSC-32, ASME Winter Annual Meeting, Atlanta, Georgia, December 1-6, 1991, pp. 181-190.
153. P. Cheung, R. Horowitz, and R. Howe, ÒModeling and Position-Detection of a Polysilicon Linear Microactuator,Ó Micromechanical Sensors, Actuators and Systems, ASME Winter Annual Meeting, vol. DSC-32, Atlanta, Georgia, December 1-6, 1991, pp. 269-278.
154. R. I. Pratt, G. C. Johnson, and R. T. Howe, ÒMicromechanical Structures for Thin Film Characterization,Ó 6th Int. Conf. on Solid-State Sensors and Actuators (Transducers 91), San Francisco, California, June 24-28, 1991, pp. 205-208.
155. P. Krulevitch, G. C. Johnson, and R. T. Howe, ÒStress in Undoped LPCVD Polycrystalline Silicon,Ó 6th International Conference on Solid-State Sensors and Actuators (Transducers 91), San Francisco, California, June 24-28, 1991, pp. 949-952.
156. D. J. Monk, D. S. Soane, and R. T. Howe, ÒSacrificial Silicon Dioxide Wet Etching for Micromachining Applications,Ó 6th International Conference on Solid-State Sensors and Actuators (Transducers 91), San Francisco, California, June 24-28, 1991, pp. 647-650.
157. P. Cheung. R. Horowitz, and R. Howe, ÒDesign and Modeling of a Linear MicroactuatorÓ (invited), 6th Int. Precision Engineering Seminar and the 2nd Int. Conf. on Ultra Precision in Manufacturing Engineering, Braunschweig, Germany, May 27-31, 1991.
158. M. W. Judy, Y.-H. Cho, R. T. Howe, and A. P. Pisano, ÒSelf-Adjusting Microstructures,Ó 4th IEEE Micro Electro Mechanical Systems Workshop (MEMS 91), Nara, Japan, January 30 - February 2, 1991, pp. 51-56.
159. G. K. Fedder and R. T. Howe, ÒThermal Assembly of Polysilicon Microstructures,Ó 4th IEEE Micro Electro Mechanical Systems Workshop (MEMS 91), Nara, Japan, January 30 - February 2, 1991, pp. 57-62.
160. R. M. Moroney, R. M. White, and R. T. Howe, ÒUltrasonically Induced Microtransport,Ó 4th IEEE Micro Electro Mechanical Systems Workshop (MEMS 91), Nara, Japan, January 30 - February 2, 1991, 277-282.
161. R. M. Moroney, R. M. White, and R. T. Howe, ÒFluid Motion Produced by Ultrasonic Lamb waves,Ó IEEE Ultrasonics Symposium, Honolulu, Hawaii, December 4-7, 1990, pp. 355-358.
162. P. A. Krulevitch, T. D. Nguyen, G. C. Johnson, R. T. Howe, H. R. Wenk, R. Gronsky, ÒLPCVD Polysilicon Thin Films: The Evolution of Structure, Texture, and Stress,Ó Materials Research Society Fall Meeting, Boston, Mass., November 26 - December 1, 1990, Polysilicon Thin Films and Interfaces, Materials Research Society Symposium Proceedings, vol. 202, 167-172, 1991.
163. R. M. White, S. W. Wenzel, B. A. Martin, R. M. Moroney, B. J. Costello, M. A. Straub, and R. T. Howe, "Lamb-Wave Interactions with the Chemical, Biological and Physical Environment," Electrochemical Society Fall Meeting, Seattle, Washingon, October 14-19, 1990.
164. W. C. Tang, M. G. Lim, and R. T. Howe, ÒElectrostatically Balanced Comb Drive for Controlled Levitation,Ó 4th IEEE Solid-State Sensor and Actuator Workshop, Hilton Head Island, South Carolina, June 4-7, 1990, pp. 23-27.
165. J. Huang, P. Krulevitch, G. C. Johnson, R. T. Howe, and H. R. Wenk, ÒInvestigation of texture and stress in undoped polysilicon films,Ó Materials Research Society Spring Meeting, San Francisco, Calif., April 16-20, 1990, Polysilicon Thin Films and Interfaces, edited by T. Kamins, C. V. Thompson, and B. Raicu, Materials Research Society Symposium Proceedings, vol. 182, 201-206, 1990.
166. L.-S. Fan, W. Yun, R. S. Muller, R. T. Howe, and J. Huang, ÒSpiral Microstructures for the Measurement of Average Strain Gradients in Thin Films,Ó 3rd IEEE Micro Electro Mechanical Systems Workshop (MEMS 90), Napa Valley, California, February 12-14, 1990, pp. 177-181.
167. M. G. Lim, J. Chang, D. P. Schultz, R. T. Howe, and R. M. White, ÒPolysilicon Microstructures to Characterize Static Friction,Ó 3rd IEEE Micro Electro Mechanical Systems Workshop, Napa Valley, California, February 12-14, 1990, pp. 82-88.
168. R. M. Moroney, R. M. White, and R. T. Howe, ÒUltrasonic Micromotors: Physics and Applications,Ó 3rd IEEE Micro Electro Mechanical Systems Workshop, Napa Valley, California, February 12-14, 1990, pp. 182-187.
169. K. S. J. Pister, R. S. Fearing, and R. T. Howe, ÒA Planar Air-Levitated Electrostatic Actuator System,Ó 3rd IEEE Micro Electro Mechanical Systems Workshop, Napa Valley, California, February 12-14, 1990, pp. 67-71.
170. W. Yun, W. C. Tang, and R. T. Howe, ÒFabrication Technologies for Integrated Microdynamic Systems,Ó (invited paper), Integrated Micro-Motion Systems Micromachining, Control and Applications, edited by F. Harashima. Amsterdam: Elsevier Science Publishers, 1990 pp. 297-312.
171. R. M. Moroney, R. M. White, and R. T. Howe, ÒUltrasonic micromotor,Ó IEEE Ultrasonics Symposium, Montreal, Quebec, Canada, October 3-6, 1989, pp. 745-748.
172. J. Huang, K. K. Lin, J. Lau, D. A. Hodges, C. Spanos, G. C. Johnson, and R. T. Howe, ÒTexture of Undoped LPCVD Polycrystalline Silicon Films,Ó Textures in Non-Metallic Materials, ASM International, Indianopolis, Indiana, October 2-3, 1989.
173. S. C. Chang, M. W. Putty, D. B. Hicks, C. H. Li, and R. T. Howe, ÒResonant-Bridge Two-Axis Microaccelerometer,Ó 5th Int. Conf. on Solid-State Sensors and Actuators (Transducers 89), Montreux, Switzerland, June 25-30, 1989, pp. 142-143.
174. L.-S. Fan, R. T. Howe, and R. S. Muller, ÒFracture-Toughness Characterization of Brittle Thin Films,Ó 5th Int. Conf. on Solid-State Sensors and Actuators (Transducers '89), Montreux, Switzerland, June 25-30, 1989, pp. 249-250.
175. W. C. Tang, T.-C. H. Nguyen, and R. T. Howe, ÒElectrostatic-Comb Drive of Lateral Polysilicon Resonators,Ó 5th Int. Conf. on Solid-State Sensors and Actuators (Transducers 89), Montreux, Switzerland, June 25-30, 1989, pp. 138-140.
176. R. T. Howe, ÒMicrosensor and Microactuator Applications of Thin Films,Ó (invited paper), Symposium on Thin-Film Materials for Integrated Sensors, International Conference on Metallurgical Coatings, San Diego, California, April 17-21, 1989.
177. L. S. Fan, R. T. Howe, and R. S. Muller, ÒMicrostructures for Fracture Toughness Characterization of Brittle Thin Films,Ó 2nd IEEE Micro Electro Mechanical Systems Workshop (MEMS 89), Salt Lake City, Utah, February 20-22, 1989, pp. 40-41.
178. W. C. Tang, T.-C. H. Nguyen, and R. T. Howe, ÒLaterally Driven Polysilicon Resonant Microstructures,Ó 2nd IEEE Micro Electro Mechanical Systems Workshop (MEMS 89), Salt Lake City, Utah, February 20-22, 1989, pp. 53-59.
179. M. W. Putty, S. C. Chang, R. T. Howe, A. L. Robinson, and K. D. Wise, ÒOne-Port Active Polysilicon Resonant Microstructures,Ó2nd IEEE Micro Electro Mechanical Systems Workshop, Salt Lake City, Utah, February 20-22, 1989, pp. 60-65.
180. K. S. Udell, A. P. Pisano, R. T. Howe, R. M. White, and R. S. Muller, ÒMicrosensors for heat transfer and fluid flow measurements,Ó First World Conference on Experimental Heat Transfer, Fluid Mechanics, and Thermodynamics, Dubrovnik, Yugoslavia, September 4-9, 1988.
181. M. A. Huff, S. D. Senturia, and R. T. Howe, ÒA Thermally Isolated Microstructure Suitable for Gas Sensing Applications,Ó 3rd IEEE Solid-State Sensors and Actuators Workshop, Hilton Head, S.C., June 6-9, 1988, pp. 47-50.
182. T. A. Lober and R. T. Howe, ÒSurface Micromachining Processes for Electrostatic Motor Fabrication,Ó 3rd IEEE Solid-State Sensors and Actuators Workshop, Hilton Head, S.C., June 6-9, 1988, pp. 59-62.
183. R. T. Howe, ÒSurface Micromachining for Microsensors and Microactuators,Ó (invited plenary paper), 32nd Int. Symp. on Electron, Photon, and Ion Beams, Fort Lauderdale, Florida, May 31 - June 3, 1988, abstract A-2.
184. M. A. Schmidt, R. T. Howe, S. D. Senturia, and J. H. Haritonidis, ÒFabrication and testing of a micromachined shear sensor,Ó IEEE Int. Electron Devices Meeting, Washington, D.C., December 6-9, 1987, pp. 282-285.
185. R. T. Howe, ÒApplications of polysilicon films in microsensors and microactuators,Ó (invited), Polysilicon Films and Interfaces, edited by C. Y. Wong, C. V. Thompson, and K. N. Tu, Materials Research Society Proceedings, vol. 106, pp. 213-224, Boston, Mass., November 30 - December 5, 1987.
186. J. H. Lang, M. F. Schlecht, and R. T. Howe, ÒElectric micromotors: electromechanical characteristics,Ó (invited), IEEE Micro Robots and Teleoperators Workshop, Hyannis, Mass., November 8-11, 1987.
187. M. A. Schmidt, R. T. Howe, S. D. Senturia, and J. H. Haritonidis, ÒSurface micromachining of polyimide/metal composites for a shear-stress sensor,Ó IEEE Micro Robots and Teleoperators Workshop, Hyannis, Mass., November 8-11, 1987.
188. M. A. Schmidt and R. T. Howe, ÒSilicon resonant microsensors,Ó (invited), Ceramic Engineering and Science Proceedings, 8, 1019-1034, (1987).
189. R. T. Howe, ÒResonant microsensors,Ó (invited), 4th International Conference on Solid-State Sensors and Actuators (Transducers '87), Tokyo, Japan, June 2-5, 1987, pp. 843-848.
190. M. A. Schmidt, R. T. Howe, and S. D. Senturia, and J. H. Haritonidis, ÒA micromachined floating-element shear sensor,Ó 4th International Conference on Solid-State Sensors and Actuators (Transducers 87), Tokyo, Japan, June 2-5, 1987, pp. 383-386.
191. M. A. Schmidt and R. T. Howe, ÒResonant structures for integrated sensors,Ó (invited), 2nd IEEE Solid-State Sensor Workshop, Hilton Head, South Carolina, June 2-5, 1986.
192. R. T. Howe, ÒPolycrystalline silicon microstructures,Ó (invited), Micromachining and Micropackaging of Transducers, edited by C. F. Fung, P. W. Cheung, W. H. Ko, and D. G. Fleming. Amsterdam: Elsevier Science Publishers, 169-187, (1985).
193. R. T. Howe and R. S. Muller, ÒFrequency response of polycrystalline silicon microbridges,Ó 3rd Int. Conf. on Solid-State Sensors and Actuators (Transducers 85), Philadelphia, Pa., June 11-14, 1985, pp. 101-104.
194. Y.-C. Tai, R. S. Muller, and R. T. Howe, ÒPolysilicon bridges for anemometer applications,Ó 3rd Int. Conf. on Solid-State Sensors and Actuators (Transducers '85), Philadelphia, Pa., June 11-14, 1985, pp. 354-357.
195. R. T. Howe and R. S. Muller, ÒIntegrated resonant-microbridge vapor sensor,Ó IEEE Int. Electron Devices Meeting, San Francisco, California, December 10-12, 1984, pp. 213-216.
196. R. T. Howe and R. S. Muller, ÒResonant polysilicon microbridge with integrated NMOS detection circuitry,Ó Electrochemical Society Fall Meeting, vol. 84-2, New Orleans, Louisiana, October 7-12, 1984, pp. 892-893.
197. R. T. Howe and R. S. Muller, ÒPolycrystalline Silicon Micromechanical Beams,Ó Electrochemical Society Spring Meeting, vol. 82-1, Montreal, Quebec, Canada, May 9-14, 1982, pp. 184-185.
NONREFEREED PUBLICATIONS
1. R. Howe, M. Allen, A. Berlin, E. Hui, D. Monk, K. Najafi, and M. Yamakawa, ÒMicrosystems Research in Japan,Ó WTEC, Baltimore, Maryland, October 2002
2. U. Srinivasan, M. A. Helmbrecht, R. S. Muller, and R. T. Howe, ÒMEMS: Some Self-Assembly Required,Ó Optics & Photonics News, November 2002, pp. 26-30.
3. A. E. Franke, T.-J. King, and R. T. Howe, ÒIntegrated MEMS technologies,Ó (invited) MRS Bulletin, 26, 291-295 (2001).
4. T. N. Juneau, M. A. Lemkin, T. A. Roessig, W. A. Clark, R. T. Howe J. M. Bustillo, T. J. Brosnihan, and A. P. Pisano, ÒCommercialization of precision inertial sensors with integrated signal conditioning,Ó Sensors Expo West, San Jose, California, May 1998.
5. W. Yun and R. T. Howe, ÒS-D Modulator interfacing with silicon microsensors,Ó Sensors, 10, May 1993, pp. 11-18.
6. W. Yun and R. T. Howe, ÒSigma-Delta modulator interfacing with microsensors,Ó (invited paper), Sensors Expo West, San Jose, California, March 2-4, 1993, pp. 159-164.
7. W. Yun and R. T. Howe, ÒRecent developments in silicon microaccelerometers,Ó Sensors, 9, October 1992, pp. 31-41.
8. W. Yun and R. T. Howe, ÒSilicon microfabricated accelerometers: a perspective on recent developmentsÓ (invited paper), Sensors Expo, Chicago, Ill., October 1-3, 1991, pp. 204A-1 - 204A-8.
9. R. T. Howe, R. S. Muller, K. J. Gabriel, and W. S. N. Trimmer, "Silicon micromechanics: sensors and actuators on a chip," IEEE Spectrum, 27, July 1990, pp. 29-35.
10. R. T. Howe, ÒSilicon Microdynamic Systems: Recent Developments in Microactuators and Micromachinery,Ó (invited paper), IEEE WESCON, San Francisco, California, November 14-16, 1989, pp. 202-204.
PATENTS
1. R. S. Muller and R. T. Howe, ÒIntegrated circuit sensor,Ó U.S. #4,674,319, June 23, 1987.
2. R. T. Howe and S.-C. Chang, ÒResonant accelerometer,Ó U.S. #4,805,456, February 21, 1989 and U.S. #4,851,080, July 25, 1989.
3. R. T. Howe, M. Mehregany, and S. D. Senturia, ÒReleased film structures and method of measuring film properties,Ó U.S. #4,823,607, April 25, 1989.
4. H.-S. Lee, J. T. Kung, and R. T. Howe, ÒA digital technique for precise measurement of variable capacitance,Ó U.S. #4,860,232, August 22, 1989.
5. J. H. Haritonidis, R. T. Howe, M. A. Schmidt, and S. D. Senturia, ÒTurbulent shear force sensor,Ó U.S. #4,896,098, January 23, 1990.
6. R. T. Howe, J. H. Lang, M. F. Schlecht, M. A. Schmidt, and S. D. Senturia, ÒElectrostatic micromotor,Ó U. S. #4,943,750, July 24, 1990.
7. R. T. Howe, J. H. Lang, M. F. Schlecht, M. A. Schmidt, and S. D. Senturia, ÒElectrostatic micromotor,Ó U. S. #4,997,521, March 5, 1991.
8. W. C. Tang and R. T. Howe, ÒLaterally Driven Resonant Microstructures,Ó U. S. #5,025,346, June 18, 1991.
9. R. T. Howe, J. H. Lang, M. F. Schlecht, M. A. Schmidt, S. D. Senturia, M. Mehregany, and L. S. Tavrow, ÒMethod for Side Drive Electrostatic Micromotor,Ó U. S. #5,043,043, August 27, 1991.
10. T. A. Core and R. T. Howe, ÒMethod for fabricating microstructures,Ó U.S. #5,314,572, May 24, 1994.
11. R. L. Alley, R. T. Howe, and K. Komvopoulos, ÒMethod of applying a monolayer lubricant to micromachines,Ó U.S. #5,403,665, April 4, 1995.
12. L. Lin, C. T.-C. Nguyen, R. T. Howe, and A. P. Pisano, ÒMicromechanical signal processors,Ó U.S. #5,455,547, October 3, 1995.
13. C. T.-C. Nguyen and R. T. Howe, ÒQ-Controlled microresonators and tunable electronic filters using such resonators,Ó U.S. #5,491,604, February 13, 1996.
14. R. T. Howe, H. J. Barber, and M. Judy, ÒApparatus to minimize stiction in micromachined structures,Ó U.S. #5,542,295, August 6, 1996.
15. R. T. Howe and S. Bart, ÒSensor with separate actuator and sense fingers,Ó U.S. #5,565,625, October 15, 1996.
16. L. Lin, C. T. Nguyen, R. T. Howe, and A. P. Pisano, ÒMicroelectromechanical signal processor fabrication,Ó U.S. #5,589,082, Dec. 31, 1996.
17. R. T. Howe, R. S. Payne, and S. F. Bart, ÒSub-ground plane for micromachined device,Ó U.S. #5,639,542, June 17, 1997.
18. K. H.-L. Chau, R. T. Howe, R. S. Payne, Y. Zhao, T. A. Core, and S. J. Sherman, ÒConductive plane beneath suspended structure,Ó U.S. #5,640,039, June 17, 1997.
19. C. T.-C. Nguyen, V. Gutnik, and R. T. Howe, ÒMixing, Modulation and Demodulation via Electromechanical Resonators,Ó U. S. #5,839,062, November 17, 1998.
20. K. S. Lebouitz, R. T. Howe, and A. P. Pisano, ÒMicrofabricated filter and shell constructed with a permeable membrane,Ó U.S. #5,919,364, July 6, 1999.
21. C. T.-C. Nguyen and R. T. Howe, ÒQ-controlled microresonators and tunable electric filters using such resonators,Ó U.S. #5,955,932, September 21, 1999.
22. T. A. Roessig, A. P. Pisano, and R. T. Howe, ÒResonant accelerometer with flexural leverage system,Ó U.S. #5,969,249, October 19, 1999.
23. W. A. Clark, T. Juneau, and R. T. Howe, ÒMicromachined vibratory rate gyroscope,Ó U.S. # 6,067,858, May 30, 2000.
24. M. R. Houston, R. Maboudian, R. T. Howe, and U. Srinivasan, ÒMethod of drying micromachines by dewetting from a liquid-based process,Ó U. S. #6,114,044, September 5, 2000.
25. M. B. Cohn and R. T. Howe, ÒWafer-to-wafer transfer of microstructures using break-away tethers,Ó U.S. #6,142,358, November 7, 2000.
26. A. E. Franke, T. J. King, and R. T. Howe, ÒSilicon germanium films for forming microelectromechanical systems,Ó U.S. #6,210,988 B1, April 3, 2001.
27. C. T.-C. Nguyen and R. T. Howe, ÒQ-controlled microresonators and tunable electronic filters using such resonators,Ó U.S. #6,236,281 B1.
28. A. A. Seshia and R. T. Howe, ÒDual-mass micromachined vibratory rate gyroscope,Ó U.S. #6,250,156 B1, June 26, 2001.
29. W. A. Clark, T. Juneau, and R. T. Howe, ÒMethod of fabricating a sensor,Ó U.S. #6,296,779, October 2, 2001.
30. A. Franke, R. T. Howe, and T.-J. King, ÒPolycrystalline silicon germanium films for micro-electromechanical systems,Ó U.S. #6,448,622 B1, September 10, 2002.
31. K. S. Lebouitz, R. T. Howe, and A. P. Pisano, ÒMicrofabricated filter and shell constructured with a permeable polysilicon membrane,Ó U.S. #6,478,974 B1, November 12, 2002.
32. A. Shkel and R. T. Howe, ÒMicro-machined angle-measuring gyroscope,Ó U.S. #6,481,285 B1, November 19, 2002.
33. D. Gao, R. T. Howe, and R. Maboudian, ÒSelective etching of silicon carbide films,Ó U.S. # 7,151,277, Dec. 19, 2006.
34. E. P. QuŽvy and R. T. Howe, ÒTemperature compensated oscillator including MEMS resonator for frequency control,Ó U.S. #7,211,926, May 1, 2007.
35. H. Takeuchi, E. P. QuŽvy, T.-J. King, and R. T. Howe, ÒDamascene process for use in fabricating semiconductor structures havning micro/nano gaps,Ó U.S. #7,256,107, August 14, 2007.
36. R. T. Howe, E. P. Quevy, and D. H. Berstein, ÒMEMS structure having a stress inverter temperature-compensating resonating member,Ó U.S. #7,514,853, April 7, 2009.
37. S. A. Bhave and R. T. Howe, ÒInternal electrostatic transduction structures for bulk-mode micromechanical resonators,Ó U.S. #7,522,019, April 21, 2009.