Noah Helman

Ph. D. Applied Physics, Stanford University, 2005

Department of Applied Physics

M.S. Applied Physics, Stanford University, 2001
A.B. Physics,
Harvard University, 1998

Birthplace: Boston, MA

 

 

Optoelectronic Modulators for Optical Interconnections

As computer technology advances, the information processing power of silicon CMOS chips is always increasing.  Yet, the information transmission properties of the wires that connect these chips to each other are limited by fundamental physical factors.  In order for the performance of the total system to continue to improve, this interconnection problem must be solved.

Long distance telecommunications networks currently use fiber optics to transmit information.  Many groups have investigated using optical links instead of electrical wires to connect these silicon chips to each other inside smaller systems like computers and internet routers.  Of course, in order to utilize electronic chips with an optical interconnection, some device must be used to convert the signals from the electrical domain into the optical domain and vice versa.

We have focused our research in the area of semiconductor optoelectronic modulators to perform this function.  An ideal modulator would exhibit the following features:

·        High contrast ratio

o       For high quality optical signal integrity

·        Low voltage drive

o       For compatibility with the low voltages of future CMOS chips.

·        Wide wavelength range

o       For optical systems that use wavelength-division multiplexing (which allows a higher aggregate data transfer rate) or that use uncooled laser sources off-chip (which are less expensive than fixed-wavelength cooled lasers).

·        Surface-normal optical access

o       For fabrication in two-dimensional arrays (which also permits a higher aggregate data rate).

·        Centered on a wavelength range in the telecommunications C-band at l~1.55mm.

o       For compatibility with existing fiber-based telecom networks.

·        Simple fabrication and packaging features such as tolerance to misalignments of the device with respect to the input and output optical beams.

o       For simpler, less expensive and more practical complete optical interconnection systems.

We have developed a new architecture called the quasi-waveguide angled-facet electroabsorption modulator (QWAFEM).  The QWAFEM is a p-i-n diode surrounded by two flat mirrors etched into the semiconductor substrate at equal angles, steeper than 45° with respect to the x-axis, as shown below.  The input laser beam passes through the transparent substrate and reflects off one angled mirror before entering the p-i-n diode at a large incident angle.  The absorption of the light is modulated by the voltage applied across the diode which typically contains multiple quantum wells (MQW).  The beam then reflects off the semiconductor-air interface, passes back through the diode, reflects off the second angled mirror and exits through the substrate.

This design achieves all of the points laid out above, including the misalignment tolerance, as demonstrated in the animation below.

 

QWAFEM devices were grown via MOCVD in the InGaAsP/InP material system in collaboration with David Bour at Agilent Labs.  The fabrication was carried out in the Ginzton Microfab, Stanford Nanofabrication Facility and NNIN at UCSB (with help from Ning Cao).  The key step is the formation of the angled mirrors.  We use a two-step wet chemical etching process based on selective etching of the crystallographic planes of InP (see P. Bonsch et al. in J.Electrochem.Soc., v.145, p.1273-6 (1998).)  The first step uses HBr to etch V-grooves which define the (111)A plane surface at 54.7 degrees from the (100) plane.  The second step greatly reduces the roughness of this surface to mirror-quality.

The scanning electron micrograph of some finished devices is shown below.

The contrast ratio and misalignment tolerance of fabricated QWAFEMs were experimentally measured and are shown here.

(Above-Left) Contrast ratio peaks at 3.5 dB and exceeds 3 dB for a wavelength range of 10 nm for only 1 V drive.   (Above-Right) Misalignment tolerance measured by displacing the device relative to the input beam and measuring the reflectivity of the device at each point.

We are currently investigating modifications to this design in order to improve its contrast ratio for a given voltage drive (around 1V).